tag: University of Florida

Chip Industry Technical Paper Roundup: July 8
By Linda Christensen - 08 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=238 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

An LLM Approach For Large-Scale SoC Security Verification And Policy Generation (U. of Florida)
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “SoCureLLM: An LLM-driven Approach for Large-Scale System-on-Chip Security Verification and Policy Generation” was published by researchers at the University of Florida. Abstract: "Contemporary methods for hardware security verification struggle with adaptability, scalability, and availability due to the increasing complexity of the modern system-on-chips (SoCs). ... » read more

Research Bits: April 30
By Jesse Allen - 30 Apr, 2024 - Comments: 0

Sound waves in optical neural networks Researchers from the Max Planck Institute for the Science of Light and Massachusetts Institute of Technology found a way to build reconfigurable recurrent operators based on sound waves for photonic machine learning. They used light to create temporary acoustic waves in an optical fiber, which manipulate subsequent computational steps of an optical rec... » read more

Chip Industry Technical Paper Roundup: April 23
By Linda Christensen - 23 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chiplet Hardware Security Module To Mitigate Security Vulnerabilities In SiP Systems (Univ. of Florida)
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration" was published by researchers at University of Florida (Gainesville). Abstract: "The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified syst... » read more

Chip Industry Technical Paper Roundup: Mar. 19
By Linda Christensen - 19 Mar, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=206 /] More ReadingTechnical Paper Library home » read more

Distributed Batteries Within a Heterogeneous 3D IC
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits" was published by researchers at University of Florida (Gainesville) and Brookhaven National Lab. Abstract "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consum... » read more

Technical Paper Roundup: November 21
By Liz Allan - 21 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

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