Challenges Grow For 5G Packages And Modules


The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Week In Review: Manufacturing, Test


Market research What’s the CapEx outlook for 2020? Semiconductor capital spending is down in 2019, but the industry faces another slump in 2020, according to IC Insights. The firm sees a 15% decline in CapEx for 2019 with a 5% drop expected in 2020. New 300mm fab construction in Korea is still going strong despite the memory downturn, according to SEMI. “Korea’s fab construction spen... » read more

What’s Next In Advanced Packaging


Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Week In Review: Manufacturing, Test


Tariffs The Federal Communications Commission (FCC) took a step in its ongoing efforts to remove regulatory barriers that inhibit the deployment of infrastructure necessary for 5G and other advanced wireless services in the U.S. "5G networks in America are key for powering the next generation of innovation, such as artificial intelligence, the Internet of Things and smart cities. (The FCC... » read more

Sorting Out Packaging Options


Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more

Bridges Vs. Interposers


The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

OSAT Consolidation Continues


Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

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