System-Level Electro-Thermal Analysis of RDS(ON) for Power MOSFET


Authors: Rajen Murugan1, Nathan Ai2, and C.T. Kao2 1 Texas Instruments, Inc., Dallas, Texas, 75044, USA 2 Cadence Design Systems, Santa Clara, California, USA A coupled-electro-thermal RDS(ON) (drain to source ON resistance) co-analysis methodology for Power MOSFET is proposed. The methodology contains two functional modules: 1) physical field solvers and 2) equivalent circuit/network so... » read more

System Electrothermal Transient Analysis of A High Current (40A) Synchronous Step Down Converter


Authors: Rajen Murugan, Jie Chen, and Todd Harrison of Texas Instruments, Inc. and C.T. Kao and Nathan Ai of Cadence Design Systems; from Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, IPACK2019, October 7-9, 2019, Anaheim, CA, USA In this paper, we detailed the system electrothermal transi... » read more

Power/Performance Bits: Sept. 17


Silicon thermoelectrics Researchers at the University of Texas at Dallas and Texas Instruments developed a new method for thermoelectric generation that could be used with electronics to convert waste heat into reusable energy. "In a general sense, waste heat is everywhere: the heat your car engine generates, for example," said Mark Lee, professor and head of the Department of Physics at UT... » read more

Week In Review: Manufacturing, Test


Fab tools ASML said it has disagreed with any implication that it has been a victim of “Chinese espionage,” as stated in an article in a Dutch newspaper. The article discusses the results of a public court case in the United States that ASML won last year. In the case, XTAL was found by a jury to have misappropriated ASML’s confidential and proprietary information as well as trade secret... » read more

China’s Foundry Biz Takes Big Leap Forward


China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

The Race To Zero Defects


By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

Week in Review: IoT, Security, Auto


Internet of Things Arm uncorked its first forward-looking CPU roadmap and performance numbers for client computing. The company said it expects to deliver annual performance improvements of more than 15% per year through 2020. The targeted market includes 5G, always-on, always-connected devices. C3 IoT will work with Google Cloud to support artificial intelligence and Internet of Things dep... » read more

Tuesday At DAC 2018


The morning starts with the Accellera Breakfast. Accellera has made some significant progress this year and we can expect to hear about the approval of the Portable Stimulus 1.0 specification later in the conference as well as the initial release of SystemC CCI as well as a proposal for the creation of an IP Security Assurance Working Group, which will discuss standards development to address s... » read more

OSAT Consolidation Continues


Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

Challenges At The Edge


By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

← Older posts