Die-to-Die Interconnects for Chip Disaggregation


Today, data growth is at an unprecedented pace. We’re now looking at petabytes of data moving into zettabytes. What that translates to is the need for considerably more compute power and much more bandwidth to process all that data. In networking, high-speed SerDes PHYs represent the linchpin for blazing fast back and forth transmission of data in data centers. In turn, demand is increa... » read more

Design For Advanced Packaging


Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

DARPA Seeks To Engage With MEMS Industry


Napa, Calif. — DARPA is looking for a few good members of the MEMS industry to offer advice and help to the agency’s Rapid Innovation for Production MEMS (RIPM) concept. Ronald Polcawich, a program manager for the Defense Advanced Research Projects Agency’s Microsystems Technology Office, presented the keynote address on the second and final day of the 2018 MEMS & Sensors Executive... » read more

Blog Review: Oct. 31


Mentor's Joe Hupcey III digs into handling memories effectively with formal through abstraction and the easiest ways to address memory-related inconclusive results. Cadence's Paul McLellan explains DARPA's CHIPS program that aims to lower semiconductor design costs through chiplet-based designs, the current status of the work, and what the next steps will be. Synopsys' Sangeeta Kulkarni c... » read more

Week in Review: IoT, Security, Auto


Internet of Things At Arm TechCon, Arm unveiled its Neoverse brand identity, providing an infrastructure foundation for 5G, the Internet of Things, edge computing, and other applications. The Arm Neoverse IP will proliferate next year from Arm and its technology partners. With Arm’s “Ares” platform, to be introduced in 2019, the company promises to deliver 30% per-generation performance ... » read more

Week In Review: Design, Low Power


Arm announced its new roadmap promising 30% annual system performance gains on leading edge nodes through 2021. These gains are to come from a combination of microarchitecture design to hardware, software and tools. They are branding this new roadmap 'Neoverse.' The first delivery will be Ares – expected in early 2019 – for a 7nm IP platform targeting 5G networks and next-generation cloud t... » read more

The Building Blocks Of Future Compute


Eric Hennenhoefer, vice president of research at Arm, sat down with Semiconductor Engineering to talk about privacy, security, high-performance computing, accelerators, and Arm’s research. What follows are excerpts of that conversation. SE: Privacy, cybersecurity, silicon photonics, quantum computing are all hot topics today. What do you find really interesting with these emerging areas? ... » read more

Reconfigurable eFPGA For Aerospace Applications


Market research reports indicate about 10% of all dollar revenue of FPGA chips is for use in aerospace applications, and DARPA/DoD reports indicate about one-third of all dollar volume of ICs purchased by U.S. aerospace are FPGAs. FPGAs clearly are very important for aerospace applications because of a combination of short development time and the long mission life of many aerospace applica... » read more

Defect Challenges Growing In Advanced Packaging


The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

A New Type Of Switch


Back in July, Applied Materials announced that we’d been selected by the Defense Advanced Research Projects Agency (DARPA) to develop technology for AI. While Applied is engaged on the development of many disruptive technologies, it’s not often that we’re in a position to discuss them in early development. Thanks to the vision of DARPA’s Electronics Resurgence Initiative and their ... » read more

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