Rethinking Chip Verification


Key Takeaways: AI and modern tools are easing traditional verification pain, but they're not addressing the underlying bottleneck in complex designs. Work is underway to create a golden, unambiguous spec above RTL, tracing requirements from spec to implementation to verification and checking for gaps, conflicts, and inconsistencies across levels and blocks, often with AI help. Tool c... » read more

Chip Industry Week In Review


IBM unveiled a 7Å transistor architecture that uses staggered nanosheet transistors stacked on a precisely beveled angle, almost like tiles on a roof. That allows more transistors to be crammed into a given area, boosting performance by 50% or power efficiency by up to 70%. Perhaps even more important, IBM claims a 40% improvement in SRAM scaling, which is orders of magnitude faster and lower ... » read more

I/O Design Challenges Grow In AI Data Centers And HPC Clusters


Key Takeaways: A designer’s choice of I/O connectors and interconnect protocols can be the difference between a massively profitable AI chip and a flop. I/O tradeoffs impact airflow, cooling, rack design, power coming into the rack, and other critical aspects of HPC chip design. Reliability is paramount, so standards must be followed, and I/Os need redundant pins. Other innovations... » read more

Verification Methodologies Struggle To Keep Up With AI


Key Takeaways:  The rapid development of AI has resulted in new capabilities being provided to verification teams, beyond their ability to rationally insert them into accepted methodologies.  There is a lot of uncertainty about who will benefit the most from this technology. Is AI a junior engineer replacement or an enhancer?  The biggest benefits will come when AI helps engineers... » read more

Executive Outlook: Agentic AI’s Impact On Chip Design


Key Takeaways: Agentic AI has the potential to make engineers more productive, speed time to market, and automate some of the drudge work. The big challenge for design and verification engineers is where and whether they trust AI to get everything right, because there is no margin for error in semiconductors. Having humans in the loop will likely be the rule rather than the exception... » read more

Introducing An Agentic LLM For Chip Design


By Tanay Biradar, Surya Gunukula, Tengxiao Liu, and Kexun Zhang ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means "renew." In early chip design benchmarks, Renoir outperforms the base model it was trained on and cuts costs by more than half. Furthermore, it can run entirely on-premises, allowing semiconductor companies to develop faster without compromi... » read more

Chip Industry Week In Review


Dealmaking Amkor inked a 10-year agreement with TSMC to provide advanced packaging and test services in Arizona, tying TSMC’s U.S. fab expansion to domestic OSAT capacity. Trump said in a post that Apple will partner with Intel on chip design and production in the U.S., marking a second reported win for the chipmaker this month. Intel Foundry will also reportedly manufacture 3 million... » read more

Can AI Create Missing Models?


Key takeaways Models are an essential part of EDA flows, each capturing necessary detail while retaining good execution performance. Models have been expensive to create, maintain and verify, restricting their utilization, but AI may be able to significantly reduce their cost. A deeper question remains. Should AI be used to create models that help existing flows, or should AI be used... » read more

Building Multi-Agent Systems For ASIC Flows


If one AI agent can solve a problem in a certain amount of time, can multiple agents solve it faster? The answer is yes, but only if the agents have well-defined roles and targets. This is where orchestrators fit in, and why they are so critical to agentic AI. Kexun Zhang, head of research at ChipAgents, talks about what exactly AI agents are, how they can be used to solve big problems that wou... » read more

Swapping Out Chiplets: I/Os Vs. Compute


Key Takeaways: Companies can save time and money by swapping out a compute, memory, or I/O chiplet to gain technology improvements, while keeping the other dies stable. Chip architects may choose to keep their I/Os stable and swap out compute to move from a 5nm process node to 3nm to achieve performance and power improvements, or swap out memory from LPDDR5X to LPDDR6. Swapping out... » read more

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