SRAM Security Concerns Grow


SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts from planar SoCs to heterogeneous systems in package, such as those used in AI or edge processing, where chiplets frequently have their own memory hi... » read more

Chip Industry Week In Review


President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

Chip Industry Technical Paper Roundup: Mar. 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

Lowering The Computational Cost of Simulation (DOE, Princeton)


A technical paper titled “Accuracy of the explicit energy-conserving particle-in-cell method for under-resolved simulations of capacitively coupled plasma discharges” was published by researchers at Princeton University. Abstract: "The traditional explicit electrostatic momentum-conserving particle-in-cell algorithm requires strict resolution of the electron Debye length to deliver numeri... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Design Space Simulator Of Distributed Multi-Chiplet Manycore Architectures For Comm-Intensive Applications


A technical paper titled “Muchisim: A Simulation Framework for Design Exploration of Multi-Chip Manycore Systems” was published by researchers at Princeton University. Abstract: "Current design-space exploration tools cannot accurately evaluate communication-intensive applications whose execution is data-dependent (e.g., graph analytics and sparse linear algebra) on scale-out manycore sys... » read more

Chip Industry’s Technical Paper Roundup: Dec 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=171 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Chiplet Architecture: Scalable and Cost-Efficient Systems for Irregular Applications (Princeton)


A new technical paper titled "DCRA: A Distributed Chiplet-based Reconfigurable Architecture for Irregular Applications" was published by researchers at Princeton University. Abstract "In recent years, the growing demand to process large graphs and sparse datasets has led to increased research efforts to develop hardware- and software-based architectural solutions to accelerate them. While... » read more

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