Chip Industry Week In Review

By The SE Staff - 24 Jul, 2026 - Comments: 0

Notable deals Amkor and Nvidia signed a $1.5B multiyear agreement to develop advanced packaging and test technologies for next-gen AI and accelerated-computing platforms. Nvidia’s prepayment will support Amkor’s U.S. capacity expansion in Arizona, including high-density interconnect and heterogeneous integration capabilities. Siemens announced plans to acquire two EDA companies: D... » read more

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Startup Funding: Q1 2026

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

by Jesse Allen

All AI Data Center Interconnects Will Be Optical Within 5 Years

InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics, co-packaged optics, optical circuit switch).

by Geoff Tate

The Sub-2nm Paradox

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.

by Ed Sperling

TSMC Tech Symposium 2026, By The Numbers

Foundry rolls out aggressive new roadmap, focusing on area, power, and latency.

by Barry Pangrle

When Semiconductor Materials Misbehave

The gap between lab performance and fab reality is growing wider as packages grow more complex.

by Gregory Haley

Silicon Photonics Lights The Way To More Efficient Data Centers

Optical is the future, but getting there is harder than it looks.

by Katherine Derbyshire

Memory Wall Gets Higher

With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon.

by Brian Bailey

TSV Complexity Leads To Manufacturing Bottleneck

Creating through-silicon vias is a necessary but daunting challenge.

by Laura Peters

tag: Hugging Face

Chip Industry Week In Review

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