Research Bits: Dec. 3


Self-assembly of mixed-metal oxide arrays Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors with high yield and could be used for more complex electronic devices. “Our self-assembling approach is significantly faster and less expensi... » read more

Chip Industry Technical Paper Roundup: Sept. 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=356 /] More ReadingTechnical Paper Library home » read more

Relative Humidity in Conductive Atomic Force Microscopy (KAUST)


A new technical paper titled "The Effect of Relative Humidity in Conductive Atomic Force Microscopy" was published by researchers at KAUST. Abstract "Conductive atomic force microscopy (CAFM) analyzes electronic phenomena in materials and devices with nanoscale lateral resolution, and it is widely used by companies, research institutions, and universities. Most data published in the field o... » read more

Chip Industry Technical Paper Roundup: July 16


New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

Monolithic 3D TFT Integration at Room Temperature, Used to Stack 10 Vertical Layers


A new technical paper titled "Three-dimensional integrated metal-oxide transistors" was published by researchers at KAUST (King Abdullah University of Science and Technology). Abstract "The monolithic three-dimensional vertical integration of thin-film transistor (TFT) technologies could be used to create high-density, energy-efficient and low-cost integrated circuits. However, the develo... » read more

Resilient And Secure Programmable SoC Accelerator Offload (KAUST)


A technical paper titled “Resilient and Secure Programmable System-on-Chip Accelerator Offload” was published by researchers at King Abdullah University of Science and Technology (KAUST). Abstract: "Computational offload to hardware accelerators is gaining traction due to increasing computational demands and efficiency challenges. Programmable hardware, like FPGAs, offers a promising plat... » read more

Chip Industry Technical Paper Roundup: June 10


New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Properties of Commercially Available Hexagonal Boron Nitride Grown By The CVD Method


A new technical paper titled "On the quality of commercial chemical vapour deposited hexagonal boron nitride" was published by researchers at KAUST and the National Institute for Materials Science in Japan. Abstract "The semiconductors industry has put its eyes on two-dimensional (2D) materials produced by chemical vapour deposition (CVD) because they can be grown at the wafer level with sm... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

Chip Industry Technical Paper Roundup: April 2


New technical papers recently added to Semiconductor Engineering’s library. [table id=211 /] Find last week’s technical paper additions here. » read more

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