tag: KAUST

Chip Industry’s Technical Paper Roundup: Dec. 13
By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

2D-Materials-Based Electronic Circuits (KAUST and TSMC)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A special edition article titled "Electronic Circuits made of 2D Materials" was just published by Dr. Mario Lanza, KAUST Associate Professor of Material Science and Engineering, and Iuliana Radu, corporate researcher at TSMC. This special issue covers 21 articles from leading subject matter experts, ranging from materials synthesis and their integration in micro/nano-electronic devices and c... » read more

Power/Performance Bits: Feb. 15
By Jesse Allen - 15 Feb, 2022 - Comments: 0

3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Power/Performance Bits: Dec. 28
By Jesse Allen - 28 Dec, 2021 - Comments: 0

Shrinking LEDs Researchers from King Abdullah University of Science and Technology (KAUST) are working to make LEDs smaller. Micrometer-scale light-emitting diodes (μLEDs) could be an ideal building block for future microLED displays, but devices based on nitride-based alloys used to achieve a broad color range become poor emitters of light when shrunk to micrometer scales. “The main ... » read more

The development of integrated circuits based on two-dimensional materials
By Technical Paper Link - 23 Nov, 2021 - Comments: 0

Abstract Two-dimensional (2D) materials could potentially be used to develop advanced monolithic integrated circuits. However, despite impressive demonstrations of single devices and simple circuits—in some cases with performance superior to those of silicon-based circuits—reports on the fabrication of integrated circuits using 2D materials are limited and the creation of large-scale circu... » read more

Power/Performance Bits: Nov. 16
By Jesse Allen - 16 Nov, 2021 - Comments: 0

Light-emitting memory Researchers from Kyushu University and National Taiwan Normal University propose a 'light-emitting memory' based on a perovskite that can simultaneously store and visually transmit data. The team used the idea in conjunction with resistive RAM (RRAM), in which states of high and low resistance represent ones and zeros. "The electrical measurements needed to check the r... » read more

Sputtered transparent electrodes for optoelectronic devices: Induced damage and mitigation strategies
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract: Summary "Transparent electrodes and metal contacts deposited by magnetron sputtering find applications in numerous state-of-the-art optoelectronic devices, such as solar cells and light-emitting diodes. However, the deposition of such thin films may damage underlying sensitive device layers due to plasma emission and particle impact. Inserting a buffer layer to shield against such da... » read more

Standards for the Characterization of Endurance in Resistive Switching Devices
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract "Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to... » read more

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

Power/Performance Bits: Aug. 17
By Jesse Allen - 17 Aug, 2021 - Comments: 0

Digital fiber Researchers at MIT, Harrisburg University of Science and Technology, and Rhode Island School of Design developed a digital fiber that can sense, store, analyze, and infer activity after being sewn into a shirt. "This work presents the first realization of a fabric with the ability to store and process data digitally, adding a new information content dimension to textiles and a... » read more

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