Chip Industry Technical Paper Roundup: Mar. 19

UCIe-3D; LLMs for EDA, HW design; reprogrammable light-based processor; distributed batteries 3D IC; processing-using-DRAM; power side-channel attacks; memristors based on resistive switching; all-optical computing.


New technical papers recently added to Semiconductor Engineering’s library.

Technical Paper Research Organizations
Hardware Phi-1.5B: A Large Language Model Encodes Hardware Domain Specific Knowledge Kansas State University and others
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express Intel
Programmable high-dimensional Hamiltonian in a photonic waveguide array RMIT University and others
On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits University of Florida and Brookhaven National Lab

Functionally-Complete Boolean Logic in Real DRAM Chips: Experimental Characterization and Analysis ETH Zurich
Hardware/Software Cooperative Design Against Power Side-Channel Attacks on IoT Device Tokyo Institute of Technology and the University of Electro-Communications
Thermal Compact Modeling and Resistive Switching Analysis in Titanium Oxide-Based Memristors Universidad de Granada, Leibniz-Institut für innovative Mikroelektronik, Universidad Politécnicade Madrid, University of Twente, KAUST, and Universitat de Barcelona
An All-Optical General-Purpose CPU and Optical Computer Architecture Akhetonics

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