Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.

After two decades of experimentation, the semiconductor industry is scrambling to embrace this approach.

Race begins to figure out what else can be done with data. But not all data is useful, and some of it is faulty.

The mundane aspects of a system can make or break a solution, and interfaces often define what is possible.

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Device degradation becomes limiting factor in IC scaling, and a significant challenge in advanced SoCs.

How cost-sensitive are IoT edge devices, what are the real drivers for this industry, and what is the impact on EDA and IP?

Dynamic power density and rising leakage power becoming more problematic at each new node.

In a world that favors digital circuitry, analog has increasingly had to cope with processes that have become less favorable to them. But that may be changing

Timing and variability have long been missing from automated transistor-level simulation tools. At advanced nodes, an update will be required.

Just relying on faster processor clock speeds isn’t sufficient for vision processing, and the idea is spreading to other markets.

Minimizing power consumption for a given amount of work is a complex problem that spans many aspects of the design flow. How close can we get to achieving the optimum?