tag: Washington University in St. Louis

Research Bits: September 11
By Jesse Allen - 11 Sep, 2023 - Comments: 0

Combining digital and analog Researchers from École Polytechnique Fédérale de Lausanne (EPFL) propose integrating 2D semiconductors with ferroelectric materials for joint digital and analog information processing, which could improve energy efficiency and support new functionality. The device uses a 2D negative-capacitance tungsten diselenide/tin diselenide tunnel FET (TFET), which consu... » read more

Chip Industry’s Technical Paper Roundup: May 23
By Linda Christensen - 23 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=104 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

EV Charging Hardware Attacks
By Technical Paper Link - 19 May, 2023 - Comments: 0

A technical paper titled "ChargeX: Exploring State Switching Attack on Electric Vehicle Charging Systems" was published by researchers at Michigan State University, Washington University in St. Louis, and Texas A&M University. Abstract: "Electric Vehicle (EV) has become one of the promising solutions to the ever-evolving environmental and energy crisis. The key to the wide adoption of E... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Research Bits: Aug. 23
By Jesse Allen - 23 Aug, 2022 - Comments: 0

Algae-powered microprocessor Engineers from the University of Cambridge, Arm Research, Scottish Association for Marine Science, and Norwegian University of Science and Technology used a widespread species of blue-green algae to power an Arm Cortex M0+ microprocessor continuously for over a year. The algae, Synechocystis, is non-toxic and harvests energy from photosynthesis. The tiny electri... » read more

Research Bits: April 19
By Jesse Allen - 19 Apr, 2022 - Comments: 0

Processor power prediction Researchers from Duke University, Arm Research, and Texas A&M University developed an AI method for predicting the power consumption of a processor, returning results more than a trillion times per second while consuming very little power itself. “This is an intensively studied problem that has traditionally relied on extra circuitry to address,” said Zhiy... » read more

An adaptive synaptic array using Fowler–Nordheim dynamic analog memory
By Technical Paper Link - 29 Mar, 2022 - Comments: 0

Abstract "In this paper we present an adaptive synaptic array that can be used to improve the energy-efficiency of training machine learning (ML) systems. The synaptic array comprises of an ensemble of analog memory elements, each of which is a micro-scale dynamical system in its own right, storing information in its temporal state trajectory. The state trajectories are then modulated by a sys... » read more

Quantifying Rowhammer Vulnerability for DRAM Security
By Technical Paper Link - 14 Mar, 2022 - Comments: 0

Abstract: "Rowhammer is a memory-based attack that leverages capacitive-coupling to induce faults in modern dynamic random-access memory (DRAM). Over the last decade, a significant number of Rowhammer attacks have been presented to reveal that it is a severe security issue capable of causing privilege escalations, launching distributed denial-of-service (DDoS) attacks, and even runtime attack ... » read more

Power/Performance Bits: Feb. 15
By Jesse Allen - 15 Feb, 2022 - Comments: 0

3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Power/Performance Bits: Nov. 3
By Jesse Allen - 03 Nov, 2020 - Comments: 0

Wirelessly charging multiple devices Researchers from ITMO University developed a metamaterial that can be used to turn surfaces into wireless charging areas for multiple devices from different manufacturers with different power transfer standards. "There are various wireless power transfer standards with different frequencies, so you can't just use a charger by any manufacturer," said Poli... » read more

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