Monolithic 3D TFT Integration at Room Temperature, Used to Stack 10 Vertical Layers


A new technical paper titled "Three-dimensional integrated metal-oxide transistors" was published by researchers at KAUST (King Abdullah University of Science and Technology). Abstract "The monolithic three-dimensional vertical integration of thin-film transistor (TFT) technologies could be used to create high-density, energy-efficient and low-cost integrated circuits. However, the develo... » read more

Roadmap To Neuromorphic Computing (Collaboration of 27 Universities/Companies)


A technical paper titled “Roadmap to Neuromorphic Computing with Emerging Technologies” was published by researchers at University College London, Politecnico di Milano, Purdue University, ETH Zurich and numerous other institutions. Summary: "The roadmap is organized into several thematic sections, outlining current computing challenges, discussing the neuromorphic computing approach, ana... » read more

Chip Industry Technical Paper Roundup: Mar. 19


New technical papers recently added to Semiconductor Engineering’s library. [table id=206 /] More ReadingTechnical Paper Library home » read more

Resistive Switching Analysis In Titanium Oxide-Based Memristors Including Surface Scanning Thermal Microscopy


A technical paper titled “Thermal Compact Modeling and Resistive Switching Analysis in Titanium Oxide-Based Memristors” was published by researchers at Universidad de Granada, Leibniz-Institut für innovative Mikroelektronik, Universidad Politécnicade Madrid, University of Twente, King Abdullah University of Science and Technology (KAUST), and Universitat de Barcelona. Abstract: "Resist... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Research Bits: July 24


Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Chip Industry’s Technical Paper Roundup: July 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

Gallium Oxide Flash Memory (KAUST & IIT)


A technical paper titled "Demonstration of β-Ga2O3 nonvolatile flash memory for oxide electronics" was published by researchers at King Abdullah University of Science and Technology (KAUST) and Indian Institute of Technology. Abstract: "This report demonstrates an ultrawide bandgap β-Ga2O3 flash memory for the first time. The flash memory device realized on heteroepitaxial β-Ga2O3 film... » read more

Research Bits: July 18


Miniaturized ferroelectric FETs Researchers from the University of Pennsylvania, Hanyang University, King Abdulaziz University, King Abdullah University of Science and Technology, and University of Tokyo proposed a new ferroelectric FET (FE-FET) design with improved performance for both computing and memory. The transistor layers the two-dimensional semiconductor molybdenum disulfide (MoS2)... » read more

Week In Review: Semiconductor Manufacturing, Test


The European Union’s Chips Act Commission has approved €8.1 billion ($8.73 billion) in funding for an Important Project of Common European Interest (IPCEI). As part of this IPCEI, 56 companies, including small and medium-sized enterprises (‘SMEs') and start-ups, will undertake 68 projects in research, innovation, and deployment of microelectronics and communication technologies across th... » read more

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