Week In Review: Manufacturing, Test


Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

Week In Review: Manufacturing, Test


Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

The Week In Review: Manufacturing


Gartner has released a chart, which tracks the “Hype Cycle for Emerging Technologies in 2014.” According to the chart, here’s some of the technologies that are still a number of years away from reaching the marketplace: virtual personal assistants; human augmentation; brain-computer interface; quantum computing; smart robots; biochips; smart advisors; autonomous vehicles; and natural-lang... » read more

Smartphones Drive Component Sales


The impact of smartphones on electronic components and semiconductors is growing. As reported by the Nihon Keizai Newspaper in October, the total value of orders received in Q3 for six major electronic components set a record. Also, in Taiwan, the overseas orders in September increased to 38.4 billion dollars, which is a 2% increase compared with the same month of the previous year, as reported... » read more

Bluetooth Smart Becomes Centerpiece Of Internet Of Things


There was a consistent theme at the CEATEC 2013, which was held in Makuhari, Chiba Prefecture—Bluteooth Smart as an essential component of the Internet of Things. Photo 1 CEATEC hall Major parts makers such as Rohm and Murata, Mitsumi, and Alps, which are developing entire modules as well as discrete parts, proposed a number of solutions that will be used over the next two or three ... » read more