Week In Review: Manufacturing, Test


Tariffs The United States and China are in the midst of a trade war. New data shows that tariffs on imported Chinese products now cost the technology industry an additional $1 billion per month, according to the Consumer Technology Association (CTA). Nearly 70% of tariffs paid by the hi-tech industry come from the $200 billion product list enacted Sep. 24. Tariffs on CTA-identified tech pro... » read more

Week In Review: Design


Deals eSilicon teamed up with Sunflower Mission once again to present 59 university scholarships for engineering and technology students in Vietnam. Foxconn, the huge Taiwanese contract manufacturer (aka Hon Hai Precision Industry), already announced plans to build a chip plant in Zhuhai, outside of Hong Kong. Now it has developed plans to assemble high-end iPhones in India next year. What'... » read more

Blog Review: Dec. 19


Cadence's Dave Pursley checks out the state of high-level synthesis and notes that 39% of survey respondents expect to be using it for the majority of designs within three years. In a video, Mentor's Colin Walls digs into how to measure RTOS performance with a focus on interrupt latency. Synopsys' Taylor Armerding chats with Chenxi Wang of Rain Capital to find what the security landscape will... » read more

Fab Equipment Challenges For 2019


After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

What’s Changing In Memory


As emerging big data and artificial intelligence (AI) applications, including machine learning, drive innovations across many industries, the issue of how to advance memory technologies to meet evolving computing requirements presents several challenges for the industry. The mainstream memory technologies, DRAM and NAND flash, have long been reliable industry workhorses, each optimized for s... » read more

Industry 4.0 Reaches Into the Subfab


To unlock the full potential of their manufacturing systems and personnel, companies in many industries are rapidly moving toward highly automated systems and digital data-driven methods and tools. Widely known as “smart manufacturing” or Industry 4.0, the resulting productivity improvements are often so dramatic that many people are calling this shift a new industrial revolution. The se... » read more

Week In Review: Manufacturing, Test


Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

November Startup Funding: Big Deals Dominate


A dozen tech startups involved in mobility, software, cybersecurity, robotics and smart payment terminals each raised $100 million or more in November. Big deals in automation, transportation sharing That $100 million figure came most often from SoftBank’s Vision Fund, a Japanese-based fund that is also backed by big investors such as Apple, Abu Dhabi’s government, and famously the Kingdom... » read more

Blog Review: Dec. 5


Mentor's Harry Foster digs into verification effectiveness in FPGA projects and what it means that so many non-trivial bugs escape into production. Cadence's Paul McLellan checks out an effort to integrate photonics with CMOS and find the tradeoffs in three different approaches, plus the view of photonics as applied to military aircraft. Synopsys' Richard Solomon shares some highlights on... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

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