Preparing For The Multiphysics Future of 3D ICs


3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Extraction Challenges of CFET and Backside Power Delivery


The integration of complementary field-effect transistors (CFETs) and buried power rails (BPRs) is central to advancing semiconductor scaling for nodes at 3nm and below. CFETs achieve unprecedented device density by vertically stacking n-type and p-type transistors, while BPRs embed the power network within the silicon substrate to boost efficiency and minimize area usage. These advances drive ... » read more

Blog Review: Mar. 25


Synopsys' Jayraj Nair checks out how a model-based systems engineering workflow can help manage the complex multiphysics analysis needed to optimize heterogeneous systems. Siemens' Melville Bryant explains the difference between semiconductor traceability and tracking and why they're both essential, especially for complex multi-die devices. Cadence's Jamdagni Trivedi checks out VIP option... » read more

Auto Ethernet 10BASE-T1S Steps Up, With Tbps On The Horizon


Key Takeaways: Automotive Ethernet, particularly 10BASE-T1S, is emerging as a replacement for CAN in vehicle networks, with higher speeds anticipated for future autonomous and connected cars. The transition to Ethernet in automotive domains is not universal; some OEMs may retain CAN or LIN in certain areas due to cost, and integrating various Ethernet standards can be technically feasib... » read more

Chip Industry Week In Review


War impacts The Iran War's toll on the chip industry is widening. Over 95% of Taiwan's energy is imported, causing the country to secure alternative sources. Korea is also heavily dependent on energy imports from the Middle East. Shortages of key materials are cropping up everywhere. Helium from Qatar, the second largest producer behind the U.S., is constrained by hostilities in the Per... » read more

Blog Review: Mar. 18


Cadence's Jamdagni Trivedi explains the UALink Protocol Level Interface, which defines how devices exchange data and control information, and shares insights into its structure, functionality, and significance in multi-node accelerator systems. Synopsys' Dustin Todd argues that AI sovereignty will be defined by and built on strategic interdependence, where countries develop and retain meanin... » read more

An Integrated Workflow For Circuit Design, Simulation, And Functional Safety Analysis


By Daniel Zhang and Claudius Jordan Functional safety analysis is a crucial step in the development of safety-critical systems. It ensures that the system-under-development meets its defined safety requirements and functions safely under both nominal and fault conditions. In the event of a failure, the system must respond appropriately to mitigate the risk of safety hazards that could potent... » read more

Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Chip Industry Week in Review


Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still. Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i... » read more

Chip Industry Week In Review


Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections.  Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

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