Week In Review: Design, Low Power


eSilicon will be acquired by Inphi Corporation and Synopsys. Inphi is acquiring the majority of the company, including the ASIC business and 56/112G SerDes design and related IP, for $216 million in both cash and the assumption of debt. Inphi expects to combine its DSP, TiA, Driver and SiPho products with eSilicon’s 2.5D packaging and custom silicon design capabilities for electro-optics, 5nm... » read more

Week In Review: Design, Low Power


Allegro DVT acquired Amphion Semiconductor, bringing together two developers of video codec IP. Allegro DVT said the merger will make it the first semiconductor IP company to offer commercially available hardware-based, real-time encoder and decoder solutions for the new AV1 video encoding format for SoC implementations, supporting 4K/UHD up to 8K. Based in Belfast, Northern Ireland, Amphion wa... » read more

Week in Review: IoT, Security, Autos


Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week In Review: Design, Low Power


M&A Dialog Semiconductor will acquire Creative Chips for approximately $80 million cash, with contingent consideration of up to $23 million. The move will expand Dialog's Industrial IoT portfolio, adding Creative Chips' industrial Ethernet and other mixed-signal products for connecting large numbers of IIoT sensors to industrial networks. Based in Bingen, Germany, Creative Chips was founded in... » read more

Week in Review – IoT, Security, Autos


Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Advanced Packaging Options Increase


Designing, integrating and assembling heterogeneous packages from blocks developed at any process node or cost point is proving to be far more difficult than expected, particularly where high performance is one of the main criteria. At least part of the problem is there is a spectrum of choices, which makes it hard to achieve economies of scale. Even where there is momentum for a particular ... » read more

Week In Review: Design, Low Power


M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

Week in Review: IoT, Security, Auto


Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Week in Review: IoT, Security, Auto


Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

Week In Review: Design, Low Power


Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

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