Challenges Of Testing Advanced Packages

Bundling more chips or chiplets increases the difficulty of thoroughly testing a device.


The number of things that can wrong in assembly and test increases as more chips are added into a package. Testing is the usual guarantor of a reliable device, but in an advanced package there are all sorts of new issues — more contacts, different handling requirements, the necessary thermal conditions for test, and variation within the package. George Harris, vice president of global test services at Amkor, talks with Semiconductor Engineering about what’s changed in testing advanced packages, including multiple processes, the impact of different substrates, the need for different insertion points, as well as new issues involving data sharing and data security.

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