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Data-driven Scheduling for High-mix and Low-volume Production in Semiconductor Assembly and Testing


Abstract: The objective of this research is to improve scheduling decisions in high-mix low-volume (HMLV) production environments. Unique characteristics of HMLV semiconductor assembly and testing operations include: (1) Diversified Product Lines: To respond to global competition and different customer needs, manufacturers are providing diversified products to different consumers; (2) Unrelate... » read more

Total Critical Area For Optimizing Test Patterns


Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Making Test Transparent With Better Data


Data is critical for a variety of processes inside the fab. The challenge is getting enough consistent data from different equipment and then plugging it back into the design, manufacturing, and test flows to quickly improve the process and uncover hard-to-find defective die. Progress is being made. The inspection and test industry is on the cusp of having more dynamic ways to access the dat... » read more

Designing Chips For Test Data


Collecting data to determine the health of a chip throughout its lifecycle is becoming necessary as chips are used in more critical applications, but being able to access that data isn't always so simple. It requires moving signals through a complex, sometimes unpredictable, and often hostile environment, which is a daunting challenge under the best of conditions. There is a growing sense of... » read more

Geo-Spatial Outlier Detection


Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

Design For Test Data


As design pushes deeper into data-driven architectures, so does test. Geir Eide, director for product management of DFT and Tessent Silicon Lifecycle Solutions at Siemens Digital Industries Software, talks with Semiconductor Engineering about a subtle but significant shift for designing testability into chips so that test data can be used at multiple stages during a device’s lifetime. » read more

5G Chips Add Test Challenges


The advent of chips supporting millimeter-wave (mmWave) 5G signals is creating a new set of design and testing challenges. Effects that could be ignored at lower frequencies are now important. Performing high-volume test of RF chips will require much more from automated test equipment (ATE) than is required for chips operating below 6 GHz. “MmWave design is a pretty old thing,” said Y... » read more

Chip Monitoring And Test Collaborate


As on-chip monitoring becomes more prevalent in complex advanced-node ICs, it’s easy to question whether or not it conflicts with conventional silicon testing. It might even supplant such testing in the future. Or alternatively, they could interact, with each supporting the other. “On-chip monitors provide fine-grained observability into effects and issues that are otherwise difficult or... » read more

AI In Inspection, Metrology, And Test


AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

The Other Side Of AI System Reliability


Adding intelligence into pervasive electronics will have consequences, but not necessarily what most people expect. Nearly everything electronic these days has some sort of "smart" functionality built in or added on. This can be as simple as a smoke alarm that alerts you when the batteries are running low, a home assistant that learns your schedule and dials the thermostat up or down, or a r... » read more

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