Making Heterogeneous Integration More Predictable


Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Challenges Of Testing Advanced Packages


The number of things that can wrong in assembly and test increases as more chips are added into a package. Testing is the usual guarantor of a reliable device, but in an advanced package there are all sorts of new issues — more contacts, different handling requirements, the necessary thermal conditions for test, and variation within the package. George Harris, vice president of global test se... » read more

Shift Left, Extend Right, Stretch Sideways


The EDA industry has been talking about shift left for a few years, but development flows are now being stretched in two additional ways, extending right to include silicon lifecycle management, and sideways to include safety and security. In addition, safety and security join verification and power as being vertical concerns, and we are increasingly seeing interlinking within those concerns. ... » read more

The Data Revolution Of Semiconductor Production


During our insightful panel discussion on “The Data Revolution of Semiconductor Production – How Advancements in Technology Unlock New Insights,” we covered several topics including machine learning, edge computing and cloud-based data management. We discussed questions including: Are we creating the right data and doing enough with it? What needs to be done to make data actionable? Ho... » read more

Ramping Up IC Predictive Maintenance


The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are employing in-circuit monitors embedded in SoC designs to catch device failures earlier in the production flow. But for ICs in the field, data tracing from design to application use only recently has ... » read more

Removing Barriers For End-To-End Analytics


Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

The Importance Of Layering Data


The chip industry generates enormous quantities of data, from design through manufacturing, but much of it is unavailable or incomplete. And even when and where it is available, it is frequently under-utilized. While there has been much work done in terms of establishing traceability and data formats, the cross-pollination of data between companies and between equipment makers at various pro... » read more