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New Developments Of Copper Plating Technology For Embedded Power Chip Packages Challenges


Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind via aspect ratios increase, development of a reliable plating technology is very important. When the depth of through hole was over 200µm, it is difficult to fill without void by using direct curr... » read more