Author's Latest Posts


New Security Risks Create Need For Stealthy Chips


Semiconductors are becoming more vulnerable to attacks at each new process node due to thinner materials used to make these devices, as well as advances in equipment used to simulate how those chips behave. Thinner chips are now emitting light, electromagnetic radiation and various other types of noise, which can be observed using infrared and acoustic sensors. In addition, more powerful too... » read more

Where Is The Edge?


Mike Fitton, senior director of strategic planning at Achronix, talks about what the edge will look like, how that fits in with the cloud, what the requirements are both for processing and for storage, and how this concept will evolve. » read more

Security Tradeoffs In A Shifting Global Supply Chain


Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

The Great Data Flood Ahead


The number of devices connected to the Internet is expected to exceed 1 trillion devices over the next decade or so. The timeline is a bit fuzzy, in part because no one is actually counting all of these devices, but the implications are pretty clear. A data deluge of biblical proportions is headed our way, and so far no one has any idea of what to do with all of it. From a system-level s... » read more

Why Data Is So Difficult To Protect In AI Chips


Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

Memory Subsystems In Edge Inferencing Chips


Geoff Tate, CEO of Flex Logix, talks about key issues in a memory subsystem in an inferencing chip, how factors like heat can affect performance, and where these kinds of chips will be used. » read more

Stacking Memory On Logic, Take Two


True 3D-ICs, where a memory die is stacked on top of a logic die using through-silicon vias, appear to be gaining momentum. There are a couple reasons why this is happening, and a handful of issues that need to be considered before even seriously considering this option. None of this is easy. On a scale of 1 to 10, this ranks somewhere around 9.99, in part because the EDA tools needed to rem... » read more

Why DRAM Won’t Go Away


Semiconductor Engineering sat down to talk about DRAM's future with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allan, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of that conversation. Part ... » read more

The New CXL Standard


Gary Ruggles, senior staff product marketing manager at Synopsys, digs into the new Compute Express Link standard, why it’s important for high bandwidth in AI/ML applications, where it came from, and how to apply it in current and future designs. » read more

Making Better Use Of Memory In AI


Steven Woo, Rambus fellow and distinguished inventor, talks about using number formats to extend memory bandwidth, what the impact can be on fractional precision, how modifications of precision can play into that without sacrificing accuracy, and what role stochastic rounding can play. » read more

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