The case for sharing test, manufacturing, and design data.
Increasing complexity due to advanced packaging, multi-die assemblies, and more devices under test is having an impact on yield, which in turn slows time to market and impacts overall chip costs. What’s needed is a way to share data that previously was siloed by chipmakers, fabs, and OSATs. Jayant D’Souza, technical product director at Siemens EDA, talks about the underlying drivers for sharing data, how it can be done securely, and why this is suddenly getting so much attention.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply