tag: Cadence

Bare Metal Programming
By Ann Steffora Mutschler - 29 Nov, 2018 - Comments: 0

As the need for safety and security grows across application areas such as automotive, industrial, and in the cloud, the semiconductor industry is searching for the best ways to protect these systems. The big question is whether it is better to build security and safety into hardware, into software, or both. The answer isn't entirely clear yet, but one of the options under consideration is s... » read more

IP Tracking and Management
By Brian Bailey - 29 Nov, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss IP tracking and management with Ranjit Adhikary, VP of marketing for ClioSoft; Jim Bruister, director digital systems (since retired) at Silvaco; Marc Greenberg, product marketing group director at Cadence; and Kelvin Low, VP of Marketing at Arm. What follows are excerpts from that conversation. SE: What is the scope of the problem? What are ... » read more

Delivering Superior Throughput For EDA Verification Workloads
By Cadence - 28 Nov, 2018 - Comments: 0

Perhaps no industry is more competitive than modern electronics manufacturing and chip design. As consumers, we take it for granted that electronic devices continue to get faster, cheaper, and more capable with each generation. From smart watches to industrial controls to electronic heart-rate monitors, electronics manufacturers are challenged to build smarter, more complex devices leveraging s... » read more

Blog Review: Nov. 28
By Jesse Allen - 28 Nov, 2018 - Comments: 0

Arm's Bo Eyole contends that the next generation of machine learning algorithms will have to deal with a vast amount of messy, unlabeled data and takes a look at some of the techniques, such as reinforcement learning and evolutionary computing, now being explored. Cadence's Paul McLellan considers how IP systems are increasingly limited by memory bandwidth rather than compute power and where... » read more

Getting Down To Business On Chiplets
By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Overcoming Gender Stereotypes In Tech
By Ann Steffora Mutschler - 23 Nov, 2018 - Comments: 5

Gender inequality in the workplace is more complex and deep-rooted than most studies have shown, and efforts to address those issues are only scratching the surface. The problem runs deeper than just moving women into upper management. It extends all the way through organizations in ways that aren't always obvious. “I've been talking to senior women in engineering and junior women in en... » read more

Blog Review: Nov. 21
By Jesse Allen - 21 Nov, 2018 - Comments: 0

Cadence's Paul McLellan looks at why specialized architectures will be the future of processor development, why general purpose processors are a poor match for AI, and other highlights from the recent Linley Processor Conference. Mentor's Harry Foster focuses on what's happening in FPGA design and the factors that are adding to increasing design and verification complexity. Synopsys' Lewi... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Nov, 2018 - Comments: 0

Cadence taped out a complete GDDR6 memory IP solution consisting of PHY, controller and Verification IP on Samsung's 7LPP process. The GDDR6 IP allows up to 16Gb/sec bandwidth per pin, or over 500Gb/sec peak bandwidth between the SoC and each GDDR6 memory die. It is targeted at very high-bandwidth applications including AI, cryptocurrency mining, graphics, ADAS and HPC. ClioSoft debuted a So... » read more

Foundries Prepare For Battle At 22nm
By Mark LaPedus - 19 Nov, 2018 - Comments: 0

After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Week In Review: Design, Low Power
By Jesse Allen - 16 Nov, 2018 - Comments: 0

Tools & Standards Mentor uncorked a PCB design platform for non-specialist PCB engineers focused on multi-dimensional verification. The Xpedition platform can integrate a range of verification tools within a singular authoring environment, providing automatic model creation, concurrent simulation, cross probing from results, and error reviews to identify problems at the schematic or layout... » read more

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