Chip Industry Technical Paper Roundup: Oct. 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Research Bits: Oct. 29


Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

Research Bits: Oct. 22


3D-printed active electronics Researchers from MIT demonstrated fully 3D-printed semiconductor-free resettable fuses. Produced using standard 3D printing hardware and an inexpensive, biodegradable polymer filament doped with copper nanoparticles, the device can perform the same switching functions as the semiconductor-based transistors used for processing operations in active electronics. A... » read more

Chip Industry Technical Paper Roundup: Oct. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Chip Industry Technical Paper Roundup: Oct. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=367 /] More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Research Bits: Oct. 14


Si-photonics chip emits beam of light MIT researchers developed a miniature, chip-based “tractor beam” that could help scientists study DNA, classify cells, and investigate the mechanisms of disease. The device uses a beam of light emitted by a silicon-photonics chip to manipulate particles millimeters away from the chip surface, while the sample remains sterile under its glass cover. T... » read more

Research Bits: Oct. 8


Soft, flexible polymer semiconductors Stanford University materials scientists used a specialized electron microscope – cryo-electron microscopy (Cryo 4D-STEM) – to explore the microstructure of soft semiconductors that could lead to new-generation electronics. Organic mixed ionic-electronic conductors (OMIECs) are soft, flexible polymer semiconductors with promising electrochemical qua... » read more

Chip Industry Technical Paper Roundup: Oct. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Research Bits: Oct. 1


Rust-resistant coating for 2D semiconductors Researchers from Pennsylvania State University, National Yang Ming Chiao Tung University in Taiwan, Purdue University, Intel, and the Kurt J. Lesker Company developed a synthesis process to produce a rust-resistant coating with properties ideal for creating faster, more durable electronics. "One of the biggest issues that we see in 2D semiconduct... » read more

Chip Industry Technical Paper Roundup: Oct. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=360 /] More ReadingTechnical Paper Library home » read more

← Older posts Newer posts →