Chip Industry Technical Paper Roundup: June 25

Metals for advanced interconnects; future of plasma etching; IR drop prediction; power electronics packaging; NVM bitflips; probabilistic circuits; quantum photonics circuits.


New technical papers recently added to Semiconductor Engineering’s library.

Technical Paper Research Organizations
Selecting Alternative Metals for Advanced Interconnects imec and KU Leuven
Future of plasma etching for microelectronics: Challenges and opportunities University of Maryland, IBM, Arkema, UCLA, Lam Research, Intel Corporation, Samsung, Air Liquide, Sony et al
IR drop Prediction Based on Machine Learning and Pattern Reduction National Tsing Hua University, National Taiwan University of Science and Technology, and MediaTek
Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs University of Cambridge, University of Warwick, Chongqing University, and SpaceX
NVM-Flip : Non-Volatile-Memory BitFlips on the System Level Ruhr-University Bochum, University of Duisburg-Essen, and Robert Bosch
On Hardware-efficient Inference in Probabilistic Circuits Aalto University and UCLouvain
Programmable Nonlinear Quantum Photonic Circuits Niels Bohr Institute, University of Copenhagen, University of Bristol, and Ruhr-Universitat Bochum

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