Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

In-Memory Computing: Techniques for Error Detection and Correction


A new technical paper titled "Error Detection and Correction Codes for Safe In-Memory Computations" was published by researchers at Robert Bosch, Forschungszentrum Julich, and Newcastle University. Abstract "In-Memory Computing (IMC) introduces a new paradigm of computation that offers high efficiency in terms of latency and power consumption for AI accelerators. However, the non-idealities... » read more

Chip Industry Week In Review


By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Research Bits: November 6


Fast superatomic semiconductor Researchers from Columbia University created a fast and efficient superatomic semiconductor material based on rhenium called Re6Se8Cl2. Rather than scattering when they come into contact with phonons, excitons in Re6Se8Cl2 bind with phonons to create new quasiparticles called acoustic exciton-polarons. Although polarons are found in many materials, those in Re6Se... » read more

Chip Industry’s Technical Paper Roundup: October 24


New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

FeFET Multi-Level Cells For In-Memory Computing In 28nm


A technical paper titled “First demonstration of in-memory computing crossbar using multi-level Cell FeFET” was published by researchers at Robert Bosch, University of Stuttgart, Indian Institute of Technology Kanpur, Fraunhofer IPMS, RPTU Kaiserslautern-Landau, and Technical University of Munich. Abstract: "Advancements in AI led to the emergence of in-memory-computing architectures as a... » read more

Chip Industry’s Technical Paper Roundup: August 22


New technical papers added to Semiconductor Engineering’s library this week. [table id=129 /]   More Reading Technical Paper Library home » read more

Power Semis Usher In The Silicon Carbide Era


Silicon carbide production is ramping quickly, driven by end market demand in automotive and price parity with silicon. Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the powe... » read more

EDA Tool To Detect SW-HW Vulnerabilities Ensuring Data Confidentiality In A RISC-V Architecture


A technical paper titled “SoftFlow: Automated HW-SW Confidentiality Verification for Embedded Processors” was published by researchers at RWTH Aachen University, Robert Bosch, and Newcastle University. Abstract: "Despite its ever-increasing impact, security is not considered as a design objective in commercial electronic design automation (EDA) tools. This results in vulnerabilities being... » read more

Week In Review: Semiconductor Manufacturing, Test


The global sales slump in semiconductors but may be stabilizing, according to a new report from the Semiconductor Industry Association (SIA). Worldwide sales of semiconductors fell 8.7% in Q1 2023 compared to the Q4 2022, and dropped 21.3% compared to the Q1 2022. Sales for the month of March 2023 increased 0.3% compared to February 2023. Meanwhile, SEMI reports worldwide silicon wafer shipment... » read more

← Older posts