Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

AI Drives More Realistic Gaming


Video games are utilizing artificial intelligence to create increasingly realistic scenarios and interactions, enabled by big increases in processing horsepower and memory, and significantly faster data movement. GPUs, once confined to graphics rendering, are now also being deployed across a wide range of AI tasks, generating more realistic non-player characters, dynamic worlds, personalized... » read more

Chip Industry Week in Review


The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Chip Industry Week In Review


Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

What’s Next For Through-Silicon Vias


From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias (TSVs) enable shorter interconnect lengths, which reduces chip power consumption and latency to carry signals faster from one device to another or within a device. Advanced packaging technology... » read more

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