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Chip Industry’s Technical Paper Roundup: Oct 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=57 /] » read more

A Full-Stack Domain-Specific Overlay Generation Framework Verified On FPGA


A new technical paper titled "OverGen: Improving FPGA Usability through Domain-specific Overlay Generation" by researchers at UCLA and Chinese Academy of Sciences. "Our essential idea is to develop a hardware generation framework targeting a highly-customizable overlay, so that the abstraction gap can be lowered by tuning the design instance to applications of interest. We leverage and ext... » read more

Week In Review: Manufacturing, Test


Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Technical Paper Round-up: August 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=44 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Reporting and Benchmarking Process For A 2D Semiconductor FET


New research paper titled "How to Report and Benchmark Emerging Field-Effect Transistors" was published from researchers at NIST, Purdue University, UCLA, Theiss Research, Peking University, NYU, Imec, RWTH Aachen, and others. "Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and compar... » read more

Toward Democratized IC Design And Customized Computing


Integrated circuit (IC) design is often considered a “black art,” restricted to only those with advanced degrees or years of training in electrical engineering. Given that the semiconductor industry is struggling to expand its workforce, IC design must be rendered more accessible. The benefit of customized computing General-purpose computers are widely used, but their performance improv... » read more

Technical Paper Round-up: June 14


New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Simulation Framework to Evaluate the Feasibility of Large-scale DNNs based on CIM Architecture & Analog NVM


Technical paper titled "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines" from researchers at UCLA. Abstract "Recently, analog compute-in-memory (CIM) architectures based on emerging analog non-volatile memory (NVM) technologies have been explored for deep neural networks (DNNs) to improve scalability, speed, and energy efficiency. Such architectures, however, leverage ... » read more

Technical Paper Round-up: April 26


Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Artificial intelligence deep learning for 3D IC reliability prediction


New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

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