Power/Performance Bits: Oct. 12


More stable quantum states Researchers at the University of Chicago found a way to make quantum systems retain coherency 10,000 times longer. The fragile nature of quantum states remains a challenge for developing practical applications of quantum computing, as they can be easily disrupted by background noise coming from vibrations, temperature changes or stray electromagnetic fields. Ap... » read more

Power/Performance Bits: June 2


Neuromorphic memristor Researchers at the University of Massachusetts Amherst used protein nanowires to create neuromorphic memristors capable of running at extremely low voltage. A challenge to neuromorphic computing is mimicking the low voltage at which the brain operates: it sends signals between neurons at around 80 millivolts. Jun Yao, an electrical and computer engineering researcher at ... » read more

Power/Performance Bits: May 26


Warmer quantum computing Researchers at the University of New South Wales Sydney, Université de Sherbrooke, Aalto University, and Keio University developed a proof-of-concept quantum processor unit cell on a silicon chip that works at 1.5 Kelvin – 15 times warmer than current chip-based technology that uses superconducting qubits. "This is still very cold, but is a temperature that can b... » read more

Covid-19 Tech Bits: April 14


Modeling coronavirus spread Four teams of Finnish researchers have modeled the coughing spread of COVID-19 in tight indoor areas, such as grocery stores and public transportation systems, using a supercomputer and 3D visualization. “The aerosol cloud spreads outside the immediate vicinity of the coughing person and dilutes in the process," said Aalto University Assistant Professor Ville V... » read more

Manufacturing Bits: Nov. 25


RF carbon nanotubes For years, the industry has been working on logic and memory devices based on carbon nanotubes, although these technologies remain in R&D. Now, there is a new device type using carbon nanotubes--RF. Startup Carbonics has developed an RF-based carbon nanotube technology that operates at frequencies over 100GHz. The technology exceeds the cutoff frequency of today... » read more

Power/Performance Bits: Nov. 5


Conductive yarn Researchers at Drexel University created an electrically conductive coating for yarn that withstands wearing, washing, and industrial textile manufacturing. Rather than using metallic fibers, the coating is made up of different sized flakes of the two-dimensional material MXene, which was applied to standard cellulose-based yarns. Titanium carbide MXene can be produced in f... » read more

Power/Performance Bits: Mar. 11


Reading qubits faster Researchers at Aalto University and VTT Technical Research Centre of Finland propose a faster way to read information from qubits, the building blocks of quantum computers. Currently, they are extremely sensitive to disruption even in cryogenic environments, holding quantum information for less than a millisecond. In the method now used to read information from a qubit... » read more

Power/Performance Bits: Sept. 18


Etching photovoltaics Researchers at Michigan Technological University and Aalto University found a way to reduce production costs of black silicon solar cells by more than 10%. The first prototype modules have been manufactured on an industrial production line. Typically, the silicon used for solar cells is etched to reduce reflected light, although some light is still lost. Nano-texturing... » read more

Power/Performance Bits: Aug. 14


All-optical logic Researchers from Aalto University developed multifunction all-optical logic gates using a network of nanowires. To build the nanostructure, the team assembled two different semiconductor nanowires, indium phosphide and aluminum gallium arsenide. The nanowires have a unique one-dimensional structure, which allows them to function like nanosized antennas for light. Using ... » read more

Manufacturing Bits: May 29


Utilizing Heat For Energy One of the big problems in electronics in general, and semiconductors particular, is heat. And it's not just about leakage current anymore. Heat is a problem at every level, from circuit design to the materials being used inside the chips, as well as warpage between die caused by heat after they are packaged together. Heat can prematurely age chips as well as destroy ... » read more

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