Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Reflectometry-Based Technique for Characterising Complex Thin-Film Structures (Aalto U. et al.)


A new technical paper, "Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio," was recent published by researchers at Aalto University, University of Eastern Finland, Chipmetrics OY, and VTT MIKES. Abstract "Deposition studies of deep vertical dips on semiconductor wafers can create problems at an industrial manufacturing scale, since cross-sectioning requires a lo... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.)


A new technical paper, "Amido-Amine Co(II) Precursor-Based Atomic/Molecular Layer Deposition Processes for Cobalt-Organic Thin Films and Their Thermal Conversion to CoO Thin Films," was published by researchers at Aalto University, Ruhr University Bochum, Tyndall National Institute, ESRF et al. "Atomic/molecular layer deposition (ALD/MLD) offers a comprehensive process and application portfo... » read more

Chip Industry Technical Paper Roundup: Dec 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=506 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Multiple QPUs With Slow Interconnects Can Outperform Single QPU Monolithic Architecture (IonQ, Aalto Univ.)


A new technical paper titled "Advantage in distributed quantum computing with slow interconnects" was published by researchers at IonQ Inc. and Aalto University. Abstract "The main bottleneck for distributed quantum computing is the rate at which entanglement is produced between quantum processing units (QPUs). In this work, we prove that multiple QPUs connected through slow interconnects... » read more

Chip Industry Week In Review


GlobalFoundries plans to acquire MIPS, adding RISC-V processor IP and PPA optimization software capabilities to its foundry offerings. MIPS will continue to operate as a standalone business within GF. The deal is expected to close in the second half of 2025. The EU rolled out new general-purpose AI rules this week to limit copyright infringement, protect public safety, and require transparency... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Low-Temperature Solid-Liquid Interdiffusion Bonding For High-Density Interconnect Applications


A new technical paper titled "Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding" was published by researchers at Aalto University in Finland. Abstract "The trend for 3D heterogeneous integration drives the need for a low-temperature bonding process for high-density interconnects (HDI). The Cu-Sn-In based solid-liquid interdiffusion (SLID) is a p... » read more

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