Chip Industry’s Technical Paper Roundup: Feb. 14

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

ILP-Based Router for Wire-Bonding FBGA Packaging Design

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more