category: Best Of Both: LP & HP

category: IoT, Security & Automotive

Harnessing Computational Storage For Faster Data Processing
By Ujjwal Negi - 14 Nov, 2024 - Comments: 0

By Ujjwal Negi and Prashant Dixit In the evolving landscape of data storage, computational storage devices (CSDs) are revolutionizing how we process and store data. By embedding processing capabilities within storage units, these devices enable in-situ data manipulation, minimizing data movement between storage and CPUs and dramatically improving performance and efficiency. This paradigm shi... » read more

Boost High-Performance IC Design Flows With Early Interactive Symmetry Checking
By Sara Khalaf - 17 Oct, 2024 - Comments: 0

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and RF designs. Achieving symmetry early in the design process helps to ensure consistent electrical behavior, which is essential for meeting performance goals and maintaining device reliability. H... » read more

Elimination Of Functional False Path During RDC Analysis
By Farhad Ahmed - 12 Sep, 2024 - Comments: 0

Reset domain crossing (RDC) issues can occur in sequential designs when the reset of a source register differs from the reset of a destination register, even if the data path is in the same clock domain. This can lead to asynchronous crossing paths and metastability at the destination register. RDC analysis on RTL designs is done to find such metastability issues in a design, which may occur du... » read more

Fantastical Creatures
By Russell Klein - 12 Aug, 2024 - Comments: 2

In my day job I work in the High-Level Synthesis group at Siemens EDA, specifically focusing on algorithm acceleration. But on the weekends, sometimes, I take on the role of amateur cryptozoologist. As many of you know, the main Siemens EDA campus sits in the shadow of Mt. Hood and the Cascade Mountain range. This is prime habitat for Sasquatch, also known as “Bigfoot”. This weekend, ar... » read more

A Guide To Rigid-Flex PCB Design
By Gregory Beers - 18 Jul, 2024 - Comments: 0

In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance or reliability. Mastering rigid-flex PCB design can be challenging due to its unique requirements. Whether you're an experienced designer expanding your skills or new to the field, this ar... » read more

High-Level Synthesis Propels Next-Gen AI Accelerators
By Russell Klein - 20 May, 2024 - Comments: 0

Everything around you is getting smarter. Artificial intelligence is not just a data center application but will be deployed in all kinds of embedded systems that we interact with daily. We expect to talk to and gesture at them. We expect them to recognize and understand us. And we expect them to operate with just a little bit of common sense. This intelligence is making these systems not just ... » read more

How To Get Accurate Inductance Extraction For Superconductor ICs
By Hossam Sarhan - 11 Apr, 2024 - Comments: 0

By Hossam Sarhan and Dusan Petranovic Supporting the high performance and reliability needed for artificial intelligence (AI), data centers and cloud computing requires powerful and efficient integrated circuits (ICs). More semiconductor companies are considering superconductor ICs for their unique properties that allow ultrafast processing of digital information. These properties include fa... » read more

The City In The Tower: 3D ICs Transform The Electronics System Landscape
By Keith Felton - 14 Mar, 2024 - Comments: 0

By Keith Felton and Todd Burkholder The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and manufactured. Yet again—as with personal computers, the internet, and smart phones—our increasingly digital world will never be the same. 3D IC architectures... » read more

The Seven Pillars Of IC Package Physical Design
By Keith Felton - 15 Feb, 2024 - Comments: 0

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what can be currently achieved in traditional monolithic SoC designs. Figure 1. A heterogeneously integrated device with 47 chiplets. (Image Source: Intel) The evolving landscape of packagin... » read more

AI-Driven Macro Placement Boosts PPA
By Janet Attar - 11 Jan, 2024 - Comments: 0

In the era of EDA 4.0, artificial intelligence (AI) and machine learning (ML) are transforming what electronic design automation tools are capable of. For many of the challenges of physical IC design, AI can provide significant benefits to both the turnaround time and the quality of the design, as measured by performance, power, and area (PPA) metrics. One implementation step due for improve... » read more

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