ConvNext Runs 28X Faster Than Fallback


Two months ago in our blog we highlighted the fallacy of using a conventional NPU accelerator paired with a DSP or CPU for “fallback” operations. (Fallback Fails Spectacularly, May 2024). In that blog we calculated what the expected performance would be for a system with a DSP needing to perform the new operations found in one of today’s leading new ML networks – ConvNext. The result wa... » read more

Research Bits: July 22


Sub-1nm gate Researchers from Korea's Institute for Basic Science, Sungkyunkwan University, Harvard University, and Korea Advanced Institute of Science and Technology (KAIST) found a method that enables epitaxial growth of 1D metallic materials with a width of less than 1 nm, which they used as a gate electrode of a miniaturized transistor. The team controlled the crystal structure of molyb... » read more

Heat-Related Issues Impact Reliability In Advanced IC Designs


Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads. All types of circuitry are vulnerable to thermal effects. It can slow the movement of the electrons through wires, cause electromigration that shortens the lifespan of... » read more

224Gbps PHY For The Next Generation Of High Performance Computing


Large language models (LLMs) are experiencing an explosive growth in parameter count. Training these ever-larger models requires multiple accelerators to work together, and the bandwidth between these accelerators directly limits the size of trainable LLMs in High Performance Computing (HPC) environments. The correlation between the LLM size and data rates of interconnect technology herald a... » read more

A Guide To Rigid-Flex PCB Design


In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance or reliability. Mastering rigid-flex PCB design can be challenging due to its unique requirements. Whether you're an experienced designer expanding your skills or new to the field, this ar... » read more

Sensor Requirements For Developing Robust Environment Perception Systems


In recent years, sensor systems for environment perception have become increasingly important – whether for adaptive robotics, automated driving, industrial process and quality control, or condition monitoring. The aim is always to detect and interpret certain environmental characteristics. In doing so, it’s important to choose not only the right algorithm but also the right sensor or senso... » read more

PCIe 7.0: Speed, Flexibility & Efficiency For The AI Era


As the industry came together for PCI-SIG DevCon last month, one thing took center stage, and that was PCI Express 7.0. While still in the final stages of development, the world is certainly ready for this significant new milestone of the PCIe specification. Let’s look at how PCIe 7.0 is poised to address the escalating demands of AI, high-performance computing, and emerging data-intensive ap... » read more

PCIe 6.0 Address Translation Services: Verification Challenges And Strategies


Address Translation Services (ATS) is a mechanism in PCIe that allows devices to request address translations from the Input/Output Memory Management Unit (IOMMU). This is particularly important where devices need to access virtual memory. ATS enhances performance by enabling devices to cache translations, reducing the latency associated with memory access. This blog delves into the semantics ... » read more

On-Device Speaker Identification For Digital Television (DTV)


In recent years, the way we interact with our TVs has changed. Multiple button presses to navigate an on-screen keyboard have been replaced with direct interaction through our voices. While this has resulted in significant improvements to the Digital Television (DTV) user experience, more can be done to provide immersive and engaging experiences. Imagine you say, “recommend me a film” or... » read more

Data Center Thermal Management Improves


Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

← Older posts