category: Low Power-High Performance

category: IoT, Security & Automotive

Leveraging Foundation IP For Low-Power AI Processor Development
By Shruti Bagaria - 15 Apr, 2025 - Comments: 0

Artificial intelligence (AI) has become widespread in recent years, quickly establishing itself as a groundbreaking technology. AI operates on machine learning (ML) algorithms, which demand substantial computational power. Traditionally, designers have utilized graphics processing units (GPUs) to run these ML algorithms. Initially created for graphics rendering, GPUs have shown to be highly eff... » read more

Research Bits: Apr. 15
By Jesse Allen - 15 Apr, 2025 - Comments: 0

Shape-morphing OLED panel with built-in speaker Researchers from Pohang University of Science and Technology (POSTECH) developed a flexible OLED panel that can freely transform its shape while simultaneously functioning as a speaker. The design is based on a based on a specialized ultra-thin piezoelectric polymer actuator that when integrated into a flexible OLED panel enables electrically ... » read more

Are You Ready For AI?
By Brian Fuller - 10 Apr, 2025 - Comments: 0

The semiconductor industry sits at the heart of the artificial intelligence revolution, providing the essential computational foundation that powers AI's rapid evolution. However, new research suggests that while AI adoption is accelerating globally, strategic implementation remains a significant challenge across industries. According to the recently released Arm AI Readiness Index Report, 8... » read more

Lego-Style Software For Automotive And Industrial Chiplet Systems?
By Andy Heinig - 10 Apr, 2025 - Comments: 0

Chiplets are a key topic in the semiconductor industry today, as they offer the potential to greatly increase the performance and flexibility of chips. The current focus is primarily on implementation, in particular on the architecture and the development of die-to-die interfaces that enable efficient communication between the individual chips. These technologies hold out the promise of meeting... » read more

Delivering Breakthrough Performance And Power Efficiency With PCIe 6
By Lou Ternullo - 10 Apr, 2025 - Comments: 0

PCI Express (PCIe) has been the backbone of high-speed data transfer in computing systems for nearly two decades. With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today's energy-conscious computing environment. PCIe 6 introduced significant technical improvements that optimize power consump... » read more

Chiplet Tradeoffs And Limitations
By Ann Mutschler - 10 Apr, 2025 - Comments: 0

The semiconductor industry is buzzing with the benefits of chiplets, including faster time to market, better performance, and lower power, but finding the correct balance between customization and standardization is proving to be more difficult than initially thought. For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave indiv... » read more

Implementing AI Activation Functions
By Bryon Moyer - 10 Apr, 2025 - Comments: 1

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes them an integral part of any neural network, but nonlinear functions can be fussy to build in silicon. Is it better to have a CPU calculate them? Should hardware function units be laid down to execute them? Or would a lookup table (LUT) suffice? Most architectures inc... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies
By Mohamed Naeim - 10 Apr, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. AI-driven inference accelerators continu... » read more

Electronics Reliability In Space: Simulating Rad Hard Designs
By Aliyah Mallak - 10 Apr, 2025 - Comments: 0

Space is a harsh environment. There’s no breathable air, radiation levels are 15 times higher than on Earth, and the approximate temperature is 2.7 Kelvin (minus 270.45 degrees Celsius or minus 454.81 degrees Fahrenheit). Thankfully, Earth’s atmosphere does a great job protecting us from space’s intense climate. But because there is no atmosphere in space, there’s nothing to protect sat... » read more

3D-IC Ecosystem Starts To Take Form
By Brian Bailey - 10 Apr, 2025 - Comments: 0

The adoption of chiplets is inevitable, but exactly when a mass migration toward this design approach will begin is yet to be determined. Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based design remains beyond the economic reach of many companies today, that is starting to change. Early signs of an emerging ecosystem ... » read more

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