Preventing Line Change Disruptions With Digital Twins


During times of crisis, companies can struggle to meet the demand for everyday necessities. Companies need to increase uptime without risking equipment or product quality. During times of crisis, like the COVID-19 pandemic, manufacturing companies can struggle to meet the demand of everyday necessities. We’ve seen this happen in real-time with the shortages of personal protective equipm... » read more

Introducing The Simulation World Virtual Conference For Multiphysics Verification


The elimination of all live seminars and conferences has been felt particularly acutely by Ansys. The company’s extraordinary breadth of simulation products across many different physics – including fluidics, mechanical, optical, electrical, materials, and semiconductors – means that dozens of events for many different industrial sectors have been cancelled or postponed this year. In r... » read more

Using AI-Optimized Tuning To Design 5G And mmWave Filters


The demand for 5G applications increases the need for radio frequency (RF) and microwave filter components in the mm-Wave frequency bands. The SynMatrix online interface with the AI-optimized tuning panel. “5G applications present some unique challenges to mm-Wave and 5G passive components,” said Diamond Liu, product manager of SynMatrix. “Fabrication capability limitations make i... » read more

Accelerated Life Testing For Failure Prediction


By Theresa Duncan and Chris South Product reliability is essential for success, especially for electronic products like printed circuit boards (PCB). Accelerated life testing (ALT) is an expedient and cost-effective solution to determine the reliability and robustness of an electronic product or component. ALT uncovers potential failure risks and quantifies the life characteristics of a p... » read more

Cloud And HPC Simulation Myths


Engineers are faced with the challenge of analyzing complex simulations while meeting tight deadlines. As a result, compute capacity is limiting the performance of many engineering organizations. High-performance computing (HPC) and cloud deployments can clear this simulation bottleneck. However, there are still misconceptions about the reliability, complexity, licensing, cost and security o... » read more

Using Digital Image Correlation To Determine BGA Warpage


Digital image correlation (DIC) is a non-contact, full-field displacement, optical measurement technique. It is often used in the following applications: Material characterization Coefficient of thermal expansion (CTE) Glass transition temperature Young’s modulus Poisson’s ratio Sample testing for fatigue and failure In situ monitoring of displacements and str... » read more

Combining Digital Twins And IoT In The Cloud


Engineers are tasked with the continuous improvement of the products, services and systems they design. The trouble is, once a product is out in the field, it’s hard to know how that design is performing — or being used. By coupling digital twin and internet of things (IoT) technology, engineers can get a better idea of a product’s real-world performance. As a reminder, digital twins a... » read more

Getting Ahead With Early Power Analysis


Today’s mobile applications need to cater to a broad set of applications. They can be communications-heavy (Bluetooth and GPS), graphics-intensive (streaming 4K videos), or compute-intensive workloads (AR/VR gaming). At the heart of this processing lies the all-powerful mobile processor, which includes a multi-core CPU, GPU, memory and other IP and subsystems for performing a variety of ta... » read more

Beyond Signoff


The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

Early Chip-Package-System Thermal Analysis


Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

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