中文 English

Modernizing Audio Codec Industry Standards For Enhanced Power Savings And Performance


Mobile phones have become a necessity, and we all use them to talk, play, communicate, and manage many aspects of our lives. While you may have an iPhone, your friends might have an Android phone  from one of several vendors. They all look and feel different, yet you can seamlessly talk with your friends. How is that possible? While they are different in some ways, they are similar in many oth... » read more

National Security And Artificial Intelligence


The (U.S.) National Security Commission on Artificial Intelligence recently published its final report. The report is 756 pages long, so I am not going to claim that I've read it all. I read the introduction and some of the conclusion, and the chapter on microelectronics (basically, semiconductors and advanced packaging). To give you a flavor, here are the opening paragraphs of the "Letter f... » read more

Die-To-Die Chiplet Communication


At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Lee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

A New Way To Create Structures


Let’s focus today on an established routing technology with a new twist! All of you are doubtless familiar with the concept of structures – formerly called via structures, renamed to structures because of their growing flexibility and application across many flows. These handy, reusable blocks of routing allow you to quickly fan out the most complex of component interfaces. And, after that,... » read more

Imec’s Plan For Continued Scaling


At IEDM in December, the opening keynote (technically "Plenary 1") was by Sri Samevadam of Imec. His presentation was titled "Towards Atomic Channels and Deconstructed Chips." He presented Imec's view of the future of semiconductors going forward, both Moore's Law (scaling) and More than More (advanced packaging and multiple die). It is always interesting to hear Imec's view of the world since... » read more

Attaching Fibers To Photonic Chips


Recently, Cadence held its fifth photonics summit, CadenceCONNECT: Photonics Contribution to High-Performance Computing. You can read my earlier posts: Photonic Integration—From Switching to Computing How to Design Photonics If You Don't Have a PhD: iPronics and Ayar Labs The third day was all about how to connect the incoming and outgoing fibers to the photonics chips. I will cov... » read more

Arm Goes For Performance


At the recent Linley Processor Conference, Arm presented two processors. This was regarded as so confidential that the original pre-conference version of the presentations didn't contain the Arm one, even though that pdf was only put online about an hour before. But most of the outline of what they presented they already talked about in May, a few months ago. I said recently that this seem... » read more

Testing For Electromagnetic Compliance Without An Anechoic Chamber


You can't sell an electronic product without getting CE or FCC (or equivalent) certification. In fact, for medical devices and aerospace, the requirements are even stricter. This doesn't just apply to obvious electronic products like laptops or automotive ECUs (electronic control units). It even applies to household goods like washers and dryers. Furthermore, this isn't just some sort of nice-t... » read more

OIP Ecosystem Forum 2020


Last Tuesday was the virtual TSMC OIP Ecosystem Forum. Apart from being virtual, the format was similar to the usual. Cliff Hou, Senior Vice President of Technology Development, opened the day with a summary of where everything is in the ecosystem around each of the new processes. There were then three keynotes by the leaders of the three big EDA companies. That was followed by more technical ... » read more

Make Acute Angles A Sharp Problem Of The Past


Sharp angles, whether they create a spike in a poured shape or form an acid trap between two different pieces of metal, are a problem for us all. As designers, we will go out of our way to try and avoid creating these situations; they will still creep into your design despite the best of intentions. How, then, can you efficiently rid your design of them with the minimal change to your routin... » read more

← Older posts