category: IP And LP In SoCs

category: IoT, Security & Automotive

3DIO IP For Multi-Die Integration
By Lakshmi Jain - 17 Oct, 2024 - Comments: 0

By Lakshmi Jain and Wei-Yu Ma The demand for high performance computing, next-gen servers, and AI accelerators is growing rapidly, increasing the need for faster data processing with expanding workloads. This rising complexity presents two significant challenges: manufacturability and cost. From a manufacturing standpoint, these processing engines are nearing the maximum size that lithogra... » read more

Simulation Replay Tackles Key Verification Challenges
By Robert Ruiz - 12 Sep, 2024 - Comments: 0

Simulation lies at the heart of both verification and pre-silicon validation for every semiconductor development project. Finding functional or power problems in the bringup lab is much too late, leading to very expensive chip turns. Thorough simulation before tapeout, coupled with comprehensive coverage metrics, is the only way to avoid surprises in silicon. However, the enormous size and comp... » read more

Ensuring Multi-Die Package Quality And Reliability
By Faisal Goriawalla - 08 Aug, 2024 - Comments: 0

Multi-die designs are gaining broader adoption in a wide variety of end applications, including high-performance computing, artificial intelligence (AI), automotive, and mobile. Despite clear advantages, there are new challenges that need to be addressed for successful multi-die realization. This article gives a high-level overview of the multi-die test challenges that go beyond the design p... » read more

224Gbps PHY For The Next Generation Of High Performance Computing
By Priyank Shukla - 18 Jul, 2024 - Comments: 0

Large language models (LLMs) are experiencing an explosive growth in parameter count. Training these ever-larger models requires multiple accelerators to work together, and the bandwidth between these accelerators directly limits the size of trainable LLMs in High Performance Computing (HPC) environments. The correlation between the LLM size and data rates of interconnect technology herald a... » read more

Why PCIe 7.0 Over Optics
By Keivan Javadi Khasraghi - 13 Jun, 2024 - Comments: 0

By Keivan Javadi Khasraghi and Ruben Sousa Data centers are currently facing the increasing need to enhance their bandwidth capacities. This surge is largely driven by the rise of new technologies, especially the growing demand for AI and machine learning applications. As these technologies advance, bandwidth requirements are projected to expand dramatically. As Large Language Models (LLMs) ... » read more

How To Successfully Deploy GenAI On Edge Devices
By Gordon Cooper - 16 May, 2024 - Comments: 0

Generative AI (GenAI) burst onto the scene and into the public’s imagination with the launch of ChatGPT in late 2022. Users were amazed at the natural language processing chatbot’s ability to turn a short text prompt into coherent humanlike text including essays, language translations, and code examples. Technology companies – impressed with ChatGPT’s abilities – have started looking ... » read more

Integrating Energy Efficiency Considerations Into Your Design From The Beginning
By William Ruby - 11 Apr, 2024 - Comments: 0

Data center networking is responsible for consuming about 1% of the global electricity supply. With the advent and integration of AI into various sectors, the pressure on both hardware and software infrastructures, necessitated by neural networks and extensive language models, is expected to increase significantly. The burgeoning energy consumption by hyperscale data centers emerges as an ur... » read more

Verifying Hardware Security With RTL Simulation
By Taruna Reddy - 14 Mar, 2024 - Comments: 0

When consumers think about security for their electronic gadgets, financial applications probably spring first to mind. Identity theft and unauthorized access to bank and investment accounts are a constant threat. But there’s more to worry about every day. Stories of webcams and smart speakers being hacked are all over the web. Users rightfully demand that device manufacturers provide a high ... » read more

Impact Of 3DHI On Aerospace And Government Applications
By Ian Land - 15 Feb, 2024 - Comments: 0

By Ian Land, Kenneth Larsen, and Rob Aitken With challenging size, weight, and power (SWaP) requirements, chip designs for aerospace, defense, and government applications are a unique breed. No surprise here, considering systems like satellites and submarines must operate reliably in the distinctly harsh environments of outer space and ocean depths, respectively. Given the SWaP criteria a... » read more

Getting Optimal PPA For HPC & AI Applications With Foundation IP
By Andrew Appleby - 11 Jan, 2024 - Comments: 0

By Andrew Appleby, Xiaorui Hu, and Bhavana Chaurasia The demand for application-specific system-on-chips (SoCs) for compute applications is ever-increasing. Today, the diversity of requirements means there is a need for a rich set of compute solutions in a wide range of process technologies. The resulting products may have very different but demanding power, performance, and area (PPA) requi... » read more

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