category: Videos

category: IoT, Security & Automotive

Challenges With Chiplets And Power Delivery
By Ed Sperling - 15 Apr, 2024 - Comments: 0

Chiplets hold the potential to deliver the same PPA benefits as an SoC, but with many more features and options that are possible on a reticle-constrained die. If chiplets live up to the hype, they will deliver what is essentially mass customization, democratizing and speeding the delivery of complex chips across a broad array of markets. Today, the focus has been on die-to-die interfaces, but ... » read more

New Issues In Power Semiconductors
By Ed Sperling - 26 Feb, 2024 - Comments: 0

The number of challenges is growing in power semiconductors, just as it is in traditional chips. Thermal dissipation and gradients, new design rules, and layout issues need to be considered, especially in the context of higher voltage and increased performance demands. Roland Jancke, design methodology head in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about issues in int... » read more

Very Short Reach SerDes In Data Centers
By Ed Sperling - 13 Dec, 2023 - Comments: 0

Speed is critical inside of data centers, and the distance that signals have to travel can have a big impact on time to results. But there are a number of variables that need to be considered, including what is an acceptable loss, how much power can be dissipated in a server rack, and what are the various connection options being used. Keivan Javadi Khasraghi, staff technical product manager at... » read more

Issues In Calculating Glitch Power
By Ed Sperling - 11 Oct, 2023 - Comments: 0

The amount of power consumed by redundant non-functional toggles, or glitch power, can be as high as 35% of total power consumption in a design. What can be done about that? Godwin Maben, low-power architect and scientist at Synopsys, takes a deep dive into the causes of glitch, how it is affected by new process nodes and heterogeneous integration, and the impact of different workloads, higher ... » read more

Changes In Memory Design
By Ed Sperling - 29 Jun, 2023 - Comments: 0

An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Impact Of Increased IC Performance On Memory
By Ed Sperling - 30 Mar, 2023 - Comments: 0

Increasing performance in advanced semiconductors is becoming more difficult as chips become more complex. There are more physical effects to contend with, different use cases, and challenges in making memory go faster. In addition, aging effects that once were ignored are now becoming critical concerns. Steven Woo, fellow and distinguished inventor at Rambus, talks about different factors that... » read more

Where Power Is Spent In HBM
By Ed Sperling - 06 Feb, 2023 - Comments: 0

HBM is gaining ground because of a spike in the amount of data that needs to be processed quickly, but big reductions in power are possible if that processing can be moved closer to the HBM modules, and if more can be done in each compute cycle without sending data back and forth to memory as frequently. Steven Woo, fellow and distinguished engineer at Rambus, talks about what can be done to bo... » read more

Choosing The Right Memory At The Edge
By Ed Sperling - 09 Jan, 2023 - Comments: 0

As the amount of data produced by sensors in cars and phones continues to grow, more of that data needs to be processed locally. It takes too much time and power to send it all to the cloud. But choosing the right memory for a particular application requires a series of tradeoffs involving cost, bandwidth, power, which can vary greatly by device, application, and even the data itself. Frank Fer... » read more

Managing IP In Heterogeneous Designs
By Ed Sperling - 14 Nov, 2022 - Comments: 0

Increasing complexity and heterogeneity is creating huge challenges for tracking different versions of IP over the lifetime of chips. Pedro Pires, applications engineer at ClioSoft, talks about the implications of IP reuse in a complex, multi-IP context, including how different standards and database formats can affect IP tracking and why an interoperability layer is essential to tracking IP an... » read more

HBM3 In The Data Center
By Ed Sperling - 17 Oct, 2022 - Comments: 0

Frank Ferro, senior director of product management at Rambus, talks about the forthcoming HBM3 standard, why this is so essential for AI chips and where the bottlenecks are today, what kinds of challenges are involved in working with this memory, and what impact chiplets and near-memory compute will have on HBM and bandwidth.     » read more

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