tag: Arteris

Toward Agentic Verification
By Brian Bailey - 28 May, 2026 - Comments: 1

Key Takeaways: Agentic verification provides flow orchestration for common repetitive tasks. Capabilities will expand when tools can learn from a larger context, including the specification. Design houses need to fully understand the costs and benefits and plan accordingly. Agentic verification is more than a buzzword. It is a pivotal moment in the evolution of verification ... » read more

Observability Is Essential For Modern Silicon
By Ann Mutschler - 28 May, 2026 - Comments: 0

Experts At The Table: In-silicon observability — also known as on-die or on-chip visibility — is becoming increasingly important for managing the performance, reliability, and security of today’s high-performance systems. Semiconductor Engineering sat down to discuss this with Andy Nightingale, vice president of product management and marketing at Arteris; Nandan Nayampally, chief commerc... » read more

Using SystemC TLM Modeling To Solve AI Data Movement Challenges
By Andy Nightingale - 28 May, 2026 - Comments: 0

In AI silicon, the performance numbers tell only part of the story. Marketing claims often highlight headline metrics such as trillions of operations per second, tensor throughput, matrix dimensions, and accelerator density. But engineers building these systems understand the harder truth. Compute performance matters only when data arrives at the right rate, with the right latency, and without ... » read more

Chip Industry Week In Review
By The SE Staff - 22 May, 2026 - Comments: 0

Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Confusion Grows With More Interconnect Options And Tradeoffs
By Liz Allan - 18 May, 2026 - Comments: 0

Key Takeaways: Designers are frequently evaluating 5 or more different interconnects in a single system, each with a distinct purpose. While chip-to-chip (PCIe) and die-to-die (UCIe, BoW) technologies seem to be solving a similar problem, in practice they bring different challenges. PCIe, CXL, NVLink, and UALink are all active in the hyperscaler space, but Ethernet-based technologies... » read more

Chip Industry Week in Review
By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Gates Add Functionality, But Wires Create Problems
By Brian Bailey - 14 May, 2026 - Comments: 0

Key takeaways: While transistors see continuous improvement, wires keep getting worse because of the smaller geometries and larger chip sizes. There are limited ways to avoid such problems, but the biggest impact will come from floorplanning. Analysis today is not adequate. New developments, such as backside power and 3D integration, provide temporary relief but new materials are a d... » read more

Building AI Without Guardrails
By Ann Mutschler - 07 May, 2026 - Comments: 0

Key Takeaways: AI governance is broadly recognized as essential, but today it remains fragmented, largely aspirational, and lacking enforceable mechanisms for accountability, runtime assurance, and global interoperability. Because AI innovation is advancing too quickly for governments or standards bodies to keep pace, practical AI governance is most likely to emerge first from high‑ri... » read more

Facilitating Complex SoC Design Through Automation And Integration
By Andy Nightingale - 30 Apr, 2026 - Comments: 0

The design demands of today’s highly advanced system-on-chip (SoC) devices have long outgrown the capabilities of manual workflows to manage them effectively. As these chips become more complex, only sophisticated, high-performance, and scalable automation can ensure that every component of the SoC functions seamlessly. The SoC integration challenge A fundamental aspect of SoC design is the... » read more

NoC Coherency Challenges Balloon With AI SoCs And Chiplets
By Liz Allan - 30 Apr, 2026 - Comments: 0

Key Takeaways Data movement, congestion, and energy efficiency are key determiners of whether compute is usable. Different processors bring various coherency challenges. For example, a cache-coherent NoC for CPUs is expensive and harder to verify than an I/O-coherent NoC for an accelerator. Designers need to balance top-down performance with bottom-up physical engineering to effect... » read more

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