Like Wayne Gretsky, EDA Aims To Be Where The Puck Is Going, Not Where It Has Been

When I launched this blog series, I set out to share some of the more unique industry transitions I’ve witnessed over my 20+ year career in EDA. The B2B sales process has not been immune to change and transition. In fact, you could create a college curriculum with a daunting syllabus on the major transitions that have impacted the B2B sales process. I won’t drop that on you. The room wh... » read more

How To Make Chiplets A Viable Market

At the recent Chiplet Summit, there was a panel session on the last afternoon titled "How to Make Chiplets a Viable Market." The panel was moderated by Meta's Ravi Agarwal, and the panelists were (from left to right in the photo): Travis Lanier of Ventana Micro Systems...actually Travis couldn't make it and Ventana was represented by Charles, but I didn't catch his last name Clint Walk... » read more

IEDM: TSMC N3 Details

I attended IEDM in San Francisco in December. There were two presentations about TSMC's N3 process. This is actually a bit of a misnomer since TSMC has two N3 processes, one simply called N3. The other (the second generation) is called N3E. The two papers were: Critical Process Features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond A 3nm CMOS FinFl... » read more

IEDM Keynote: Ann Kelleher On Future Technology

IEDM 2022 celebrated 75 Years of the Transistor. I can't imagine anything else invented in the last 75 years has had as much effect on my life, and probably yours, too. After the awards session, the conference got underway with a keynote by Ann Kelleher, Executive Vice President and General Manager of Technology Development at Intel. It was titled "Celebrating 75 Years of the Transistor! A L... » read more

Effective Measurement Is The Key To Meeting Environmental Sustainability Goals In Data Centers

Hyperscale compute, using high-performance connected processors, continually transforms our lives as more and more applications rely on this type of compute, and at the heart of this hyperscale revolution are data centers. It is estimated that an equal amount of power is required for the airflow and cooling systems as for IT equipment. The pressure is on for organizations to create and adopt l... » read more

Holistic 3D-IC Interposer Analysis In Product Designs

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization and better interconnection. This vertical stacking of ICs enables the next generation of sophisticated, intelligent devices, necessitating high chip density and terabytes of bandwidth. As per the f... » read more

Chasing The Next Level Of Productivity

The keynotes at the recent Design Automation Conference (DAC) gave some great insights into the direction of semiconductor technology and chip and system design. For the first time in a long time, my family members and friends have gained awareness of the importance of semiconductors and electronic design automation. I think this means it is also time to look back on where productivity improvem... » read more

Digital Transformation At The Farnborough Airshow 2022

Alternating every year with the Paris Airshow, the Farnborough Airshow was back to an in-person event this July 2022. It focused on six key themes—space, defense, sustainability, innovation, future flight, and workforce. Within these themes, digitalization and data emerged as very prominent messages. Some of the prototypes and actual devices on display at the event felt like they were taken s... » read more

Embedded World 2022: Structural Changes In Ecosystems

As my train approaches Nuremberg for the Embedded World conference—which this year is in June versus its usual timing in February—I am reviewing my past related blogs back to 2012. My complaints about the cold weather have been a common thread in past blogs, but with a weather forecast of 28°C/80°F, I will probably ask for cooler weather at the end of the day. Past key themes included tec... » read more

Design For Context And Its Impact On EDA

At the recent CEO panel, Ed Sperling used the term “Design for Context” as one of the key trends, identifying what others have referred to as “domain specific” or “workload specific.” The term struck a chord with me, as I see it in many customer meetings across various industry verticals in the context of a specific industry driving requirements for tools and IP. Undoubtedly, semico... » read more

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