The Evolution of HBM


High-bandwidth memory originally was conceived as a way to increase capacity in memory attached to a 2.5D package. It has since become a staple for all high-performance computing, in some cases replacing SRAM for L3 cache. Archana Cheruliyil, senior product marketing manager at Alphawave Semi, talks about how and where HBM is used today, how it will be used in the future, why it is essential fo... » read more

Blog Review: Dec. 4


Siemens' Reetika explains how creating and verifying a complete reset tree structure allows designers to trace the flow of reset signals across the design and ensure that every sequential element is tagged correctly within its respective reset domain. Cadence's Durlov Khan suggests DDR5 DIMM Memory Models and Discrete Component Models as part of a flexible approach to validating specific com... » read more

Chip Companies Play Bigger Role In Shaping University Curricula


A shortage of senior engineers with the necessary skills and experience is forcing companies to hire and train fresh graduates, a more time-consuming process but one that allows them to rise through the ranks using the companies' preferred technology and systems. Universities and companies share the goal of helping a graduate become productive in the workplace as quickly as possible, and the... » read more

Goal-Driven AI


For many, the long-term dream for AI within EDA is the ability to define a set of goals and tell the computer to go design it for them. A short while later, an optimized design will pop out. All of today's EDA tools will remain hidden, if they even exist at all. You would only be limited by your imagination. But we also know that AI is not to be trusted today, especially when millions of dol... » read more

Scaling AI Chip Design With NoC Soft Tiling


Tiling is about repeating modular units within the same chip to enhance scalability and efficiency; chiplets involve combining different silicon pieces to achieve a more diverse and powerful system within a single package. Network-on-chip (NoC) soft tiling is complimentary but distinct from chiplets described above as it repeats modular units inside a NoC design. Soft tiling within a NoC off... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1


This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

How To Speed Up LVS Verification


Layout versus schematic (LVS) comparison is a crucial step in integrated circuit (IC) design verification, ensuring that the physical layout of the circuit matches its schematic representation. The primary goal of LVS is to verify the correctness and functionality of the design. Traditionally, LVS comparison is performed during signoff verification, where dedicated tools compare layout and sche... » read more

Successful Design Of Power Management Chips


With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product categories. Everyone knows that huge chips such as CPUs and GPUs command high prices and that memory chips are ubiquitous. However, the domain of power management integrated circuits (PMICs) is less well known to many observers. PMICs are impressive in terms of their technol... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

The Latest Wireless Industry Use Cases


The wireless industry evolves constantly; GSMA estimates that mobile technologies and services generated 5% of the global GDP in 2022, which equates to $5.2 trillion of economic value. In parallel, more than 5.4 billion people subscribed to a mobile service, with 4.4 billion connected to the mobile internet. These numbers are impressive, but there is much more to come. 5G networks promise exp... » read more

← Older posts