AI & Energy: Bending The Curve


By Pushkar P. Apte and Melissa Grupen-Shemansky Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. AI promises many economic and social benefits, but the growth comes with an escalating demand for power, and energy has emerged as a major challenge. The AI & energy challenge AI training c... » read more

Blog Review: May 20


Cadence's Siddh Virani demonstrates how to import and integrate foreign language logic into PSS on both Target and Solve platforms, opening possibilities for code reuse and cross-language collaboration. Synopsys' Sumit Vishwakarma finds that AI model training and inference workloads are forcing the industry to rethink not only how much compute fits in a rack, but how servers are architected ... » read more

Chip Industry Week in Review


Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Blog Review: May 13


Siemens' Loay Hegazy, Mohamed Taher, and Sherif Hammouda describe a GPU rasterizer designed specifically for computational lithography and present benchmark results and practical implications for mask synthesis workflows. Cadence's Udaya Shankar introduces RTL, logic, and physical restructuring techniques and how they can help improve PPA, reduce dynamic power consumption, and optimize place... » read more

Blog Review: May 6


Synopsys' Prith Banerjee identifies key challenges in designing AI data centers and why addressing them requires a transformative approach that impacts every aspect of the system design and its individual components. Cadence's Meet S Chauhan checks out what's new in MIPI C-PHY v3.0, including the new 18 wire state mode that can support high-resolution display and image sensors and motion vec... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Blog Review: Apr. 29


Synopsys' Madhumita Sanyal shows why interface IP has emerged as the keystone for building scalable, reliable 3D multi-die designs in which interconnects often have a greater influence on overall system capability than the peak performance of individual dies. Cadence's Frank Ferro checks out why SOCAMM2 built on LPDDR is being deployed in AI data centers, increasing memory bandwidth and capa... » read more

Blog Review: Apr. 22


In a podcast, Siemens EDA's Harry Foster and Vladislav Palfy chat about why coverage closure has become one of the biggest bottlenecks in modern verification and how a unified approach that combines planning, automation, and analytics helps teams break through coverage plateaus. Synopsys' Emily Gerken and Marc Swinnen consider the challenges of designing analog and mixed-signal circuits at a... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Advancing Autonomous Fabs


The semiconductor industry is entering a critical transition phase toward Autonomous Semiconductor Fabs, driven by escalating process complexity, increasing equipment costs, and heightened demands for operational stability. In this environment, preventive maintenance (PM) is no longer a peripheral operational function but a central determinant of equipment availability, productivity, and manufa... » read more

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