The Thermal And Power Realities Of The AI Era


The rapid growth of AI has created a surge in the global energy consumption at a rate never seen before. Today, data centers account for approximately 415 terawatt-hours (TWh) of electricity globally. To put this into perspective, the annual energy consumption of the United Kingdom in 2023 measured at 309 TWh. The International Energy Agency (IEA) projects data centers’ energy consumption wil... » read more

Blog Review: Apr. 15


Cadence's Wilson Kobalkar shares why eUSB2‑V2 represents a major evolutionary step for the USB 2.0 ecosystem, including how it achieves multi‑gigabit HSx operation and why symmetric/asymmetric modes unlock new design possibilities. Synopsys' Akanksha Soni explains the difference between metal-oxide-metal, metal-insulator-metal, and metal-oxide-semiconductor capacitors, identifying the ad... » read more

EDA And IP Numbers Up Again, But Numbers Are More Nuanced


EDA and Semiconductor IP revenue grew 10.3% in Q4 2025 to $5.466 billion, up from $4.955 billion in the same period in 2024, continuing the double-digit run for the tools and IP business that has been underway for the past few years. CAE, the largest EDA category, rose 9.4% to $2.083 billion in Q4, versus $1.761 billion in Q4 2024. Non-reporting IP companies — a segment dominated by Arm �... » read more

Chip Industry Week In Review


Deals, Funding Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processo... » read more

Blog Review: Apr. 8


Cadence's Shyam Sharma highlights new capabilities in LPDDR6, including metadata built into the data packets, rowhammer mitigations, DVFS with support for three operating voltage rails, and new efficiency modes. Synopsys' Akanksha Soni points to multiphysics simulation as a key element of ensuring automotive IC designs meet ISO 26262 requirements. Siemens' John McMillan suggests a simulat... » read more

Untrusted Analog Components Add Risks For Critical Infrastructure


Key Takeaways New certificate-based solutions are necessary within fabs and packaging houses to deliver trusted semiconductors. Physical IDs bind the device to the certificate, but it needs to be immutable and unclonable. Extrinsic IDs are required for analog, mixed-signal, sensor ICs as well as discrete components. Rising concern over the source and destination of chips, an... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Blog Review: April 1


Siemens EDA's Harry Foster considers why first-silicon success is continuing to decline even though tools are capable of handling much larger design sizes and identifies how increasingly complex interactions between components cause traditional verification assumptions to break down. Synopsys' Eldo N Baby explores dynamic voltage drop analysis, including how to bring in switching scenario in... » read more

Blog Review: Mar. 25


Synopsys' Jayraj Nair checks out how a model-based systems engineering workflow can help manage the complex multiphysics analysis needed to optimize heterogeneous systems. Siemens' Melville Bryant explains the difference between semiconductor traceability and tracking and why they're both essential, especially for complex multi-die devices. Cadence's Jamdagni Trivedi checks out VIP option... » read more

Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026


By Samer Bahou and Jaegwan Shim As the global semiconductor industry enters a decisive new phase shaped by artificial intelligence, SEMICON Korea 2026 convened the ecosystem from February 11–13 in Seoul, bringing together the companies, technologies, and talent required to sustain momentum on both sides of the AI equation: using AI to transform semiconductor operations, and advancing sem... » read more

← Older posts Newer posts →