Chip Industry Week In Review

Synopsys SW security sale; U.S. yanks Intel, Qualcomm export licenses; U.S to boost IC manufacturing capacity by 3X; Indian security SoCs; HBM prices rise; Infineon’s battery monitor chip; Softbank eyes Graphcore deal.


Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys’ recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys’ president and CEO, said in an interview that the sale of the software group “gives us the ability to have management bandwidth, capital, and to double down on what we’re doing in our core business.”

The U.S. Commerce Department reportedly pulled export licenses from Intel and Qualcomm that permitted them to ship semiconductors to Huawei, the Financial Times reported. The move comes after advanced chips from Intel reportedly were used in new laptops and smartphones from the China-based company. 

Apple debuted its second-generation 3nm M4 chip with the launch of the new iPad Pro. The CPU and GPU each have up to 10 cores, with a neural engine capable of 38 TOPS, and a total of 28 billion transistors. Apple also is working with TSMC to develop its own AI processors for running software in data centers, reports The Wall Street Journal.

The U.S. is expected to triple its semiconductor manufacturing capacity by 2032, according to a new report by the Semiconductor Industry Association and Boston Consulting. By that year, the U.S. is projected to have 28% of global capacity for advanced logic manufacturing and over a quarter of total global capital expenditures.

Fig. 1: Source: Semiconductor Industry Association and Boston Consulting Group.

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Around The Globe

The U.S. Commerce Department plans to solicit bids from organizations interested in creating and managing a new CHIPS Manufacturing USA institute focused on digital twins in the semiconductor sector. The government will award up to $285 million to the selected proposal.

The U.S. National Science Foundation and Department of Energy announced the first 35 projects to be supported with computational time through the National Artificial Intelligence Research Resource (NAIRR) Pilot. The initial selected projects will gain access to several U.S. supercomputing centers and other resources, with the goal of advancing responsible AI research.

Through its new Federal AI Sandbox, MITRE is offering up its computing power to U.S. government agencies. “Our new Federal AI Sandbox will help level the playing field, making the high-quality compute power needed to train and test custom AI solutions available to any agency,” stated Charles Clancy, MITRE, senior vice president and chief technology officer, in the release.

Saudi Arabia’s $100 billion investment fund for semiconductor and AI technology pledged it would divest from China if requested by the U.S, reported Bloomberg.

Japan’s SoftBank is holding talks with UK-based AI Chip firm Graphcore about a possible acquisition, reports Bloomberg.

India’s chip industry is heating up. Mindgrove launched the country’s first SoC, named Secure IoT. The chip clocks at 700 MHz, and the company is touting its key security algorithms, secure boot, and on-chip OTP memory. Meanwhile, Lam Research is expanding its global semiconductor fabrication supply chain to include India.

Microsoft will build a $3.3 billion AI data center in Racine, Wisconsin, the same location as the failed Foxconn investment touted six years ago.

Markets And Money

The SIA announced first-quarter global semiconductor sales grew more than 15% YoY, still 5.7% below Q4 2023, but a big improvement over last year. Consider that the semiconductor materials market contracted 8.2% in 2023 to $66.7 billion, down from a record $72.7 billion in 2022, according to a new report from SEMI.

The demand for AI-powered consumer electronics will drive global AI chipset shipments to 1.3 billion by 2030, according to ABI Research.

TrendForce released several new industry reports this week. Among the highlights:

  • HBM prices are expected to increase by up to 10% in 2025, representing more than 30% of total DRAM value.
  • In Q2, DRAM contract prices rose 13% to 18%, while NAND flash prices increased 15% to 20%.
  • The top 10 design firms’ combined revenue increased 12% in 2023, with NVIDIA taking the lead for the first time.

A number of acquisitions were announced recently:

  • High-voltage IC company, Power Integrations, will purchase the assets of Odyssey Semiconductor Technologies, a developer of gallium nitride (GaN) transistors.
  • Mobix Labs agreed to buy RF design company RaGE Systems for $20 million in cash, stock, and incentives.
  • V-Tek, a packaging services and inspection company, acquired A&J Programming, a manufacturer of automated handling and programming equipment.

The global smartphone market grew 6% year-over-year, shipping 296.9 million units in Q124, according to a Counterpoint report.  Samsung toppled Apple for the top spot with a 20% share.


U.S. Justice Department is investigating whether Tesla committed securities or wire fraud for misleading consumers and investors about its EV’s autopilot capabilities, according to Reuters.

The automotive ecosystem is undergoing a huge transformation toward software-defined vehicles, spurring new architectures that can be future-proofed and customized with software.

Infineon introduced a microcontroller for the automotive battery management sector, integrating high-precision analog and high-voltage subsystems on a single chip. Infineon also inked a deal with China’s Xiaomi to provide SiC power modules for Xiaomi’s new SU7 smart EV.

Keysight and ETAS are teaming up to embed ETAS fuzz testing software into Keysight’s automotive cybersecurity platform.

Also, Keysight’s device security research lab, Riscure Security Solutions, can now conduct vehicle type approval evaluations under United Nations R155/R156 regulations. Keysight acquired Riscure in March.

Two autonomous driving companies received big funding. British AI company Wayve received a $1.05 billion Series C investment from SoftBank, with contributions from NVIDIA and Microsoft. Hyundai spent an additional $475 million on Motional, according its recent earnings report.

The automotive imaging market grew to U.S. $5.7 billion in 2023 due to increased production, autonomy demand, and higher-resolution offerings.

Automotive Grade Linux (AGL), a collaborative cross-industry effort developing an open source platform for all Software-Defined Vehicles (SDVs), released cloud-native functionality, RISC-V architecture and flutter applications.


SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts to heterogeneous systems in package, where chiplets frequently have their own memory hierarchy.

Machine learning is being used by hackers to find weaknesses in chips and systems, but it also is starting to be used to prevent breaches by pinpointing hardware and software design flaws.

txOne Networks, provider of Cyber-Physical Systems security, raised $51 million in Series B extension round of funding.

The U.S. Department of Justice charged a Russian national with his role as the creator, developer and administrator of the LockBit, a prolific ramsomware group, that allegedly stole $100 million in payments from 2,000 victims.

The Cybersecurity and Infrastructure Security Agency (CISA) launched “We Can Secure Our World,” a new public awareness program promoting “basic cyber hygiene” and the agency also issues a number of alerts/advisories.

Product News

Siemens unveiled its Solido IP Validation Suite software, an automated quality assurance product designed to work across all design IP types and formats. The suite includes Solido Crosscheck and IPdelta software, which both provide in-view, cross-view and version-to-version QA checks.

proteanTecs announced its lifecycle monitoring solution is being integrated into SAPEON’s new AI processors.

SpiNNcloud Systems revealed their SpiNNaker2 system, an event-based AI platform supercomputer containing chips that are a mesh of 152 ARM-based cores. The platform has the ability to emulate 10 billion neurons while still maintaining power efficiency and reliability.

Ansys partnered with Schrodinger to develop new computational materials. The collaboration will see Schrodinger’s molecular modeling technology used in Ansys’ simulation tools to evaluate performance ahead of the prototype phase.

Keysight introduced a pulse generator to its handheld radio frequency analyzer software options. The Option 357 pulse generator is downloadable on B- and C-Series FieldFox analyzers.

Education and Training

Semiconductor fever is hitting academia:

  • Penn State discussed its role in leading 15 universities to drive advances in chip integration and packaging.
  • Georgia Tech’s explained its research is happening at all the levels of the “semiconductor stack,” touting its 28,500 square feet of academic cleanroom space.
  • And in the past month Purdue University, Dassault Systems and Lam Research expanded an existing deal to use virtual twins and simulation tools in workforce development.

Arizona State University is beefing up their technology programs with a new bachelor’s and doctoral degree in robotics and autonomous systems.

Microsoft is partnering with Gateway Technical College in Wisconsin to create a Data Center Academy to train Wisconsinites for data center and STEM roles by 2030.


Stanford-led researchers used ordinary-appearing glasses for an augmented reality headset, utilizing waveguide display techniques, holographic imaging, and AI.

UC Berkeley, LLNL, and MIT engineered a miniaturized on-chip energy storage and power delivery, using an atomic-scale approach to modify electrostatic capacitors.

ORNL and other researchers observed a “surprising isotope effect in the optoelectronic properties of a single layer of molybdenum disulfide” when they substituted heavier isotope of molybdenum in the crystal.

Three U.S. national labs are partnering with NVIDIA to develop advanced memory technologies for high performance computing.


In addition to this week’s Automotive, Security and Pervasive Computing newsletter, here are more top stories and tech talk from the week:


Find upcoming chip industry events here, including:

Event Date Location
ASMC: Advanced Semiconductor Manufacturing Conference May 13 – 16 Albany, NY
ISES Taiwan 2024: International Semiconductor Executive Summit May 14 – 15 New Taipei City
Ansys Simulation World 2024 May 14 – 16 Online
Women In Semiconductors May 16 Albany, NY
European Test Symposium May 20 – 24 The Hague, Netherlands
NI Connect Austin 2024 May 20 – 22 Austin, Texas
ITF World 2024 (imec) May 21 – 22 Antwerp, Belgium
Embedded Vision Summit May 21 – 23 Santa Clara, CA
ASIP Virtual Seminar 2024 May 22 Online
Electronic Components and Technology Conference (ECTC) 2024 May 28 – 31 Denver, Colorado Security Trainings and Conference USA 2024 May 28 – Jun 1 Santa Clara, CA
Find All Upcoming Events Here

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

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