Chip Industry Technical Paper Roundup: Dec. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=391 /] » read more

Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)


A new technical paper titled "Pie: Pooling CPU Memory for LLM Inference" was published by researchers at UC Berkeley. Abstract "The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill over to CPU memory; however, traditional GPU-CPU memory swapping ofte... » read more

Chip Industry Technical Paper Roundup: Nov. 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Benchmark and Evaluation Framework For Characterizing LLM Performance In Formal Verification (UC Berkeley, Nvidia)


A new technical paper titled "FVEval: Understanding Language Model Capabilities in Formal Verification of Digital Hardware" was published by researchers at UC Berkeley and NVIDIA. Abstract "The remarkable reasoning and code generation capabilities of large language models (LLMs) have spurred significant interest in applying LLMs to enable task automation in digital chip design. In particula... » read more

PCM-Based Photonic Memory Cells: Design-Space Exploration And Performance Comparisons


A technical paper titled "Programmable phase change materials and silicon photonics co-integration for photonic memory applications: a systematic study" was published by researchers at Colorado State University, CEA-LETI, and UC Berkeley. Find the technical paper here. August 2024. "We delve into the performance comparison of PCM-based programmable photonic memory cells based on silicon p... » read more

Chip Industry Technical Paper Roundup: Oct. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=367 /] More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Multi-Faceted Spin Orbit Torque Phenomena in GdCo (Berkeley)


A new technical paper titled "Tunable multistate field-free switching and ratchet effect by spin-orbit torque in canted ferrimagnetic alloy" was published by researchers at UC Berkeley and Lawrence Berkeley National Laboratory. The paper states: "Spin-orbit torque is not only a useful probe to study manipulation of magnetic textures and magnetic states at the nanoscale but also it carries g... » read more

Chip Industry Technical Paper Roundup: Oct. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Review Paper: Challenges Required To Bring the Energy Consumption Down in Microelectronics (Rice, UC Berkeley, Georgia Tech, Et al.)


A new review article titled "Roadmap on low-power electronics" by researchers at Rice University, UC Berkeley, Georgia Tech, TSMC, Intel, Harvard, et al. This roadmap to energy efficient electronics written by numerous collaborators covers materials, modeling, architectures, manufacturing, metrology and more. Find the technical paper here. September 2024. Ramamoorthy Ramesh, Sayeef Sal... » read more

Chip Industry Technical Paper Roundup: Sept. 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=358 /] More ReadingTechnical Paper Library home » read more

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