Chip Industry Week In Review

By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Technical Paper Roundup: July 22

By Linda Christensen - 22 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

Excitonic Phenomena in TMDs (Harvard, Google, Stanford et al.)

By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Dynamical Control of Excitons in Atomically Thin Semiconductors" was published by researchers at Harvard University, Google Research, Stanford University, UC Riverside and others. Abstract "Excitons in transition metal dichalcogenides (TMDs) have emerged as a promising platform for novel applications ranging from optoelectronic devices to quantum optics and sol... » read more

Chip Industry Technical Paper Roundup: July 16

By Linda Christensen - 16 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home » read more

Finely Tuning The Electronic Band Structure of WSe₂ With AFM

By Technical Paper Link - 08 Jul, 2024 - Comments: 0

A technical paper titled “Strain Driven Electrical Bandgap Tuning of Atomically Thin WSe2” was published by researchers at University of Toronto, University of Tokyo, and Stanford University. Abstract: "Tuning electrical properties of 2D materials through mechanical strain has predominantly focused on n-type 2D materials like MoS2 and WS2, while p-type 2D materials such as WSe2 remain... » read more

Research Bits: June 18

By Jesse Allen - 18 Jun, 2024 - Comments: 0

Gallium nitride can take the heat Researchers from Massachusetts Institute of Technology (MIT), the UAE's Technology Innovation Institute, Ohio State University, Rice University, and Bangladesh University of Engineering and Technology investigated the performance of ohmic contacts in a gallium nitride (GaN) device at extremely high temperatures, such as those that would be required for devices... » read more

Chip Industry Week In Review

By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry Week In Review

By The SE Staff - 10 May, 2024 - Comments: 0

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

EDA Looks Beyond Chips

By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

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tag: Stanford University

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: July 22

Excitonic Phenomena in TMDs (Harvard, Google, Stanford et al.)

Chip Industry Technical Paper Roundup: July 16

Finely Tuning The Electronic Band Structure of WSe₂ With AFM

Research Bits: June 18

Chip Industry Week In Review

Chip Industry Week In Review

EDA Looks Beyond Chips

Chip Industry Week In Review

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