tag: Stanford University

EDA Looks Beyond Chips
By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

Chip Industry Week In Review
By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Research Bits: Apr. 2
By Jesse Allen - 02 Apr, 2024 - Comments: 0

Stretchy, sensitive circuits Researchers from Stanford University developed skin-like, stretchable integrated circuits capable of driving a micro-LED screen with a refresh rate of 60 Hz and detecting a braille array that is more sensitive than human fingertips. The stretchable transistors are made from semiconducting carbon nanotubes sandwiched between soft elastic electronic materials. The... » read more

Research Bits: Feb. 13
By Jesse Allen - 13 Feb, 2024 - Comments: 0

Fast phase-change memory Researchers from Stanford University, TSMC, National Institute of Standards and Technology (NIST), and University of Maryland developed a new phase-change memory for future AI and data-centric systems. It is based on GST467, an alloy of four parts germanium, six parts antimony, and seven parts tellurium, which is sandwiched between several other nanometer-thin material... » read more

Chip Industry Technical Paper Roundup: Feb. 6
By Liz Allan - 06 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

A New Phase-Change Memory For Processing Large Amounts Of Data 
By Technical Paper Link - 30 Jan, 2024 - Comments: 0

A technical paper titled “Novel nanocomposite-superlattices for low energy and high stability nanoscale phase-change memory” was published by researchers at Stanford University, TSMC, NIST, University of Maryland, Theiss Research and Tianjin University. Abstract: "Data-centric applications are pushing the limits of energy-efficiency in today’s computing systems, including those based on... » read more

Chip Industry Week In Review
By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Modeling Compute In Memory With Biological Efficiency
By Katherine Derbyshire - 19 Dec, 2023 - Comments: 0

The growing popularity of generative AI, which uses natural language to help users make sense of unstructured data, is forcing sweeping changes in how compute resources are designed and deployed. In a panel discussion on artificial intelligence at last week’s IEEE Electron Device Meeting, IBM’s Nicole Saulnier described it as a major breakthrough that should allow AI tools to assist huma... » read more

Chip Industry’s Technical Paper Roundup: Dec 11
By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons
By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

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