tag: ETAS

Chip Industry Week In Review
By The SE Staff - 10 May, 2024 - Comments: 0

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Innovative Cybersecurity Solutions Accelerate TTM For The Software-Defined Vehicle
By Adiel Bahrouch - 04 Apr, 2024 - Comments: 0

The automotive industry is undergoing a transformative shift towards the software-defined vehicle (SDV), signaling a new era that prioritizes customer-centric mobility and presents new, data-based revenue opportunities across the automotive value chain and ecosystem. However, this transition also presents many challenges, from managing increasingly complex hardware (HW) and software (SW) design... » read more

Chip Industry Week In Review
By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Zone-ECU Virtualization Solution Platform
By Renesas - 25 May, 2022 - Comments: 0

The high complexity of future vehicle systems will need to move away from today’s distributed automotive E/E architecture towards a more centralized E/E structure based on less but much more powerful ECUs, instead of many individual control entities. A Zone-oriented architecture moves the integration of numerous functions and services into one ECU. The resulting network concept must deal w... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

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