Top Stories
Electromigration Concerns Grow In Advanced Packages
Higher density, heat, and more materials make it harder to ensure reliability.
What Works Best For Chiplets
Not all chiplets are interchangeable, and options will be limited.
Enabling Advanced Devices With Atomic Layer Processes
Tradeoff between precision and speed becomes more critical at advanced nodes.
Predicting And Preventing Process Drift
AI/ML are increasingly vital for good yield and reliability, but there are still plenty of pitfalls to avoid.
Navigating The GPU Revolution
Potential cost and time benefits are driving GPU adoption, despite challenges
Blogs
Amkor’s Prasad Dhond anticipates as cars move to a central computing architecture that chiplets will be a logical solution to size and cost challenges, in Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing.
Synopsys’ Shela Aboud digs into why calculating the breakdown voltage of wide bandgap power devices is crucial, in Enabling New Applications With SiC IGBT And GaN HEMT For Power Module Design.
Lam Research’s Yu De Chen looks at testing different saddle fin profile shapes without the time and cost of wafer-based development, in Exploring Process Scenarios To Improve DRAM Device Performance.
ASE’s CP Hung shows how traditional chips are transforming into smaller, well-partitioned chiplets that require chip-to-chip interconnections, in Advanced Packaging Design For Heterogeneous Integration.
eBeam’s Jan Willis focuses on multi-beam mask writers and curvilinear design as key achievements, in eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography.
SEMI’s Margaret Kindling shares a handful of unusual electronics trivia, in Vast Universe Of Transistors, Worm-Bot Innovation, Glass-Based Processor Enhancement, And Atomically Efficient Chips.
Sponsor White Papers
IC Compiler II: Finding The Best Floorplan, Fast
A tool for floorplanning where a flat layout methodology is no longer an option.
A Vision For Electronics Supply Chain Management
The vital importance of the electronics supply chain, current challenges, and changes required to mitigate supply disruptions and meet the electronic industry’s evolving needs in the years to come.
Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing
The 2024 Deep Learning Applications List by eBeam Initiative members.
Review Of Virtual Wafer Process Modeling And Metrology For Advanced Technology Development
A demonstration of process modeling, virtual wafer fabrication, and virtual metrology in process development of advanced logic and memory.
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