tag: Arizona State University

Chip Industry Technical Paper Roundup: June 8
By Linda Christensen - 08 Jun, 2026 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective 🔗 imec, KU Leuven ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs 🔗 KAIST Thermal- and Aging-Aware Rowhamme... » read more

Analyzing Rowhammer Vulnerability in Monolithic 3D IWO eDRAM for Edge (ASU, Georgia Tech)
By Technical Paper Link - 05 Jun, 2026 - Comments: 0

Researchers from Arizona State University and Georgia Institute of Technology published “Thermal- and Aging-Aware Rowhammer Vulnerability Analysis of Monolithically-Integrated IWO eDRAM for Edge Platforms”. "This work presents the first comprehensive temperature- and aging-aware vulnerability analysis of amorphous Indium Tungsten Oxide (IWO) embedded DRAM (eDRAM), a promising next-... » read more

Orbital Data Centers Are Souped-Up Satellites – For Now
By Liz Allan - 04 Jun, 2026 - Comments: 0

Key Takeaways: Today’s orbital data centers are better described as compute centers in space, as they resemble satellite constellations more than terrestrial data centers. The most common power solution is sun-synchronous solar at the poles, but this requires a multi-hop data relay from power-hungry compute to standard satellite constellations in the low-orbit mesh, then to Earth. ... » read more

Using Graph Attention for Virtual Metrology in Semiconductor Manufacturing (Intel Foundry, ASU)
By Technical Paper Link - 02 Jun, 2026 - Comments: 0

Researchers from Arizona State University and Intel Foundry have published “Graph Attention-Based Virtual Metrology for Film Deposition Processes in Semiconductor Manufacturing”. Abstract “Artificial intelligence-driven semiconductor manufacturing increasingly operates at nanometer and angstrom scales, where precise process control depends on accurate and timely metrology. Howeve... » read more

Chip Industry Week in Review
By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week in Review
By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Limiting AI/ML Tools To Ensure Physical AI Safety, Security
By Liz Allan - 05 Mar, 2026 - Comments: 0

Key Takeaways: AI-based tools can help monitor physical AI systems and LLMs, but human oversight is still needed to avoid false positives, bias, and other anomalies. For autonomous vehicles and robots, edge case scenarios and understanding human values are weak points, especially as moral and social values change over time. AI tools are growing and becoming increasingly helpful for c... » read more

Chip Industry Week In Review
By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected
By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

Chip Industry Technical Paper Roundup: Jan 12
By Emma Riverso - 12 Jan, 2026 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=513 /] Find more semiconductor research papers here. » read more

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