Blog Review: Jan. 14


Arm's Paul Black demonstrates how lightweight LLVM sanitizers help detect undefined behavior, improve code quality, and expose hidden bugs in embedded C and C++ projects, with a focus on two sanitizers that can catch issues such as unsigned signed shift overflows, array overflows, and stack corruption. Imagination's Alex Pim provides an overview of LLM inference acceleration for mobile and e... » read more

Blog Review: Jan. 7


Cadence's Reela Samuel presents an overview of through-silicon vias, including structure, pitch, and electrical behavior, key layout rules such as keep-out zones and stress constraints, and how TSV parasitics influence bandwidth, latency, and system-level performance. Siemens' Andras Vass-Varnai identifies five thermal trends to watch and how they’ll reshape design and packaging workflows ... » read more

Blog Review: Dec. 24


Cadence's Jakob Engblom shares highlights from the recent SDV Europe conference, including why software-defined vehicles will require much closer, faster collaboration between suppliers and customers, with virtualization for software development and testing taking on a key role, as well as API questions and tire sensors. Synopsys' Tom De Schutter and Marc Serughetti predict that new cars wil... » read more

2025 – A Year Of Change And Anticipation


2025 has certainly been a year of unexpected changes. These had a significant impact on the semiconductor industry and everything that supports it. Not all the changes have been bad, but flexibility has been a requirement for continued success or to make the most of an opportunity provided. Some industries, such as aerospace and defense, are seeing a significant boost around the world. Data ... » read more

Programmable Chips Evolve For Shifting Needs


ICs and SoCs are utilizing a range of processing elements that allow them to optimize current workloads while hedging their bets for the future. What used to be a simple choice between an ASIC, FPGA, or DSP, has evolved into a mix of processor types and architectures, including varying levels of programmability and customization. Speed is essential, but technology is evolving so quickly that... » read more

Reliability Risks Shift To The Materials Stack


The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

Blog Review: Dec. 17


Cadence's Shyam Sharma checks out what's new in the latest Open NAND Flash Interface 5.2 standard, including a Separate Command Address protocol that allows Hosts to optimize the command and data scheduling to increase overall available bandwidth. Siemens' Kyle Fraunfelter and Melville Bryant contend that improving semiconductor manufacturing and fab sustainability starts with a digital twin... » read more

Limited by Power


AI is seen as a massive computation problem, but that is not the case, at least with the way that the problem is structured today. It is a data movement problem. This not only limits performance but represents most of the energy consumption. In addition, the industry spends most of its time and effort making small improvements that optimize aspects of the existing architecture, when what is ... » read more

Harness Simulation To Connect To Industry 5.0


Industry 5.0 represents a significant evolution in industrial processes, focusing on integrating human-centric approaches with advanced technologies. Unlike Industry 4.0, which emphasizes automation and digitalization, Industry 5.0 prioritizes collaboration between humans and technology. This approach broadens the scope of industrial advancements to include societal contributions alongside prod... » read more

AI Buildout Makes HPC Simulation More Challenging


Simulations of semiconductors and systems are becoming bigger, more complex, and increasingly necessary, mirroring everything that is happening to the hardware itself — particularly in AI data centers. The move beyond monolithic chips to multi-die assemblies now requires solving some thorny multi-physics challenges, such as thermal and power delivery, which are increasingly difficult to mo... » read more

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