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Blog Review: March 31


Arm's Pavel Rudko considers several common approaches used to get better performance for neural network inference on mobile devices, such as optimizing and pruning the model and using different processing units to execute different workloads in parallel. Siemens EDA's Ray Salemi introduces basic concepts of using Python for verification and how to get Python to talk to an RTL device-under-te... » read more

Week In Review: Design, Low Power


Companies Pearl Semiconductor launched to provide low and ultra-low noise timing products. “Pearl is a timing company developing resonator-agnostic solutions. We work with quartz crystals, MEMS resonators or whatever achieves superior performance,” said Ayman Ahmed, CEO of Pearl Semiconductor. “Current and future automotive applications demand low noise and a wide operating temperatur... » read more

Waiting For Chiplet Standards


The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Blog Review: March 24


Arm's Brian Cline points to a project with GlobalFoundries to demonstrate the feasibility and readiness of high-density, face-to-face, wafer-bonded 3D stacking technologies for high performance, energy-efficient designs. Synopsys' Taylor Armerding warns that while supply chain security risks aren't new, the recent SolarWinds breach should make everyone pay much more attention to dependencies... » read more

Blog Review: March 17


Synopsys' Chris Clark considers the growing number of automotive sensors and the cost/performance tradeoffs between edge computing capability, sensor fusion, sensor degradation, monitoring, and the maintenance of the software over the lifespan of a vehicle. Cadence's Paul McLellan checks out how the process of loading the bootstrap into memory has changed over the years, from hand-entered on... » read more

Designing 2.5D Systems


As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional challenges. How you adapt and change your design team may be determined by where your focus has been in the past, or what you are trying to achieve. There are business, organizational, and technical c... » read more

Week In Review: Design, Low Power


Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Ten Reasons 3D-IC Will Profoundly Change The Way You Design Electronics


The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were unable to anticipate and adjust to these powerful forces of change. Consequently, I am not alone in believing that now is the time to get ready for the next significant change to your electronic desi... » read more

Tradeoffs To Improve Performance, Lower Power


Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Blog Review: March 10


Siemens EDA's Harry Foster checks out how the maturity of verification processes impact bug escapes in FPGA designs and whether safety critical development processes prevent bugs from escaping to silicon. Synopsys' Dennis Kengo Oka examines the weaknesses and vulnerabilities in automotive keyless entry systems and how security researchers hacked the Tesla Model X key fob. Cadence's Paul M... » read more

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